William Chew Email & Phone Number

Singapore

Singapore

+ Managing a portfolio of Special Hazards products for Asia Pacific (APAC) customers.+ Managing projects that focus on growth, sustaining and strategic development of products portfolio in APAC.Achievements:+Setup Singapore Foam Analysis Laboratory for Asia Pacific region +Setup 3 UL-listed First Fill Stations in Asia Pacific distributor network

Singapore

+ Provide technical support for the existing suppression and for all technical matters, trouble shooting, technical training and warehouse/filling station EHS matters + Interface with Regional Product Sales Managers, distributors, factories to support installation and after sales service. + Manage regulatory product approvals for existing and new markets..

Responsible for managing the manufacturing and financial accountability for Hot Runner & Mold manufacturing. Establish overall business strategies and manage a team to meet specific business deliverables. My major achievements were:+ Successful startup of Technical Centre in Singapore.+ Led 945 projects with revenue of USD 47 Million. + Led application.

I was managing the Engineering and Quality Departments simultaneously to improve and support manufacturing of high capacity tape data storage unit for Dell, Quantum & Sun Microsystems. My major achievements were:+ Led project for quick Backup and recovery solution that saved USD150 000 per breakdown.+ Led project to reduce customer complaints by 80% within.

I was responsible for integrating information technology to the information and knowledge requirements and providing daily IT support of the entire Institute, as well as, a Directorate member to assist in strategic IT projects. I was also the project manager for a national R&D project developing an application for national health. My major acheivements.

In Kulicke & Soffa, a leading semiconductor equipment manufacturer, I was an Advanced Manufacturing Engineering Manager in charge of a group of 5 engineers (Electrical, Software & Mechanical). My group works concurrently with the design team to develop new wire bonders. I led the group to solve new design (Maxum and LPC wire bonders) issues and to conduct.

Managed local projects such as product development of PC technology and improvement of PC operations to enhance competitiveness. Support Asia Pacific in Product engineering, process development and SAP implementation. My achievements were:+ Attained COMPAQ PRIDE Award (achieved company’s vision) and COMPAQ Management Incentive Award+ Led projects for.

In NEC, a leading semiconductor manufacturing company, I was in charge of the front end processes for assembling integrated circuits (DRAM and Microcomputer). My major achievemnts were: + Presented improved methods of assembly to Japanese counterparts at a Quality Conference in Tokyo, Headquarters, and at subsidiaries in Hiroshima and Kyushu, Japan.+.

Master, Business In Information Technology

Activities and Societies: + Led in one of the twenty teams out of 90 teams that passed round one of the RMIT Business Plan competition.

Bachelor Of Engineering (Second Upper Class Honours), Mechanical Engineering

Activities and Societies: + Attend daily Aerobics lessons + Regular church goer + Explore Scotland, England, Wales and EuropeFavourite.

International Diploma (Distinction), Computer Studies

Activities and Societies: Shitoryu Karate Association Sin Yong Tai Chi AssociationDistinction in Computer principles and computer-related.

Technical Diploma, Mechanical Engineering

Activities and Societies: Pugilistic Martial ArtsMajor in Tool, Die and Mold Design