Willie Goolsby Email & Phone Number

Results oriented Microelectronics Characterization/Failure Analyst with experience in successfully supporting leading microelectronics company in fixing design errors, and failures on wafer level devices, packaged devices and customer returns, globally. Adept at varied sample preparation techniques, multitude of exotic materials, in a variety of packages; accomplished using single / dual beam Focused Ion Beam (FIB) systems; TEM sample prep using Ex situ and Omniprobe lift out systems; S/TEM imaging and EDS analysis.Have experienced as semiconductor capital equipment field service engineer conducting on-site installations and testing procedures to insure proper working conditions. Travel to customer site on short notice to troubleshoot and repair problems. Develop positive working relations with customers.Specialties: Recognized for initiating change, strong multitasking ability, and implementing new processes, while maintaining positive environment. Capable of strategic thinking and long-range planning, along with proven technical expertise. Established team player, adept at rendering technical expertise across organizational boundaries. Demonstrated ability to quickly understand customer needs and provide innovative and timely solutions.

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  Senior Physical Technology Development Engineer 2

  Microchip Technology Inc.

  Jan 1999 - Present - Tempe, Arizona

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  Devry University

  Electrical And Electronics Engineering