Willy Bowman Email and Phone Number
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Highly effective Engineering and Manufacturing Operations Executive, with a proven track record Specialties:* P&L responsibility at the Operations level.* Fabless Semiconductor VP Manufacturing Operations and Engineering Management.* Global Manufacturing Foundry and Assembly Test Subcontractor; Strategy, Selection, Management and Partnerships* Contract and Pricing Negotiations, Qualification and Technical management (No Purchasing Function)* Cost Reduction: Yield, Test Time, Cycle time Improvement* Risk Management / Business Continuity / Disaster RecoverySpecialties: Continued* Product Life Cycle Management PLM* CAPEX Evaluation and Negotiation* Extensive International Experience in Asia and Europe* Offshore Operations facility start up and operation (Singapore)* Leading Cross Functional Globally Dispersed Teams* Integration of acquired product lines* Product, Test & Package Engineering (Development and Sustaining)* Cu / Copper wire development and qualification* Active Secret Security Clearance******Executive Recruiters, HR Managers, Hiring Managers, CEO's, Presidents, connect with me to get access to my network deep in industry leadership and engineering talent.Interested in assisting with referrals, brainstorming and collaboration. Call me at 503-539-0563.******
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Vice President OperationsAtmosic TechnologiesSan Jose, Ca, Us
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Director, OperationsQorvo, Inc. May 2021 - PresentOoRecently acquired and now focusing on Integration of ERP systems, Operations, Supply Chain and Quality Systems. -
Head Of OperationsNextinput Jun 2019 - May 2021Mountain View, California, UsNextInput is the market leader in MEMS based force-sensing solutions driving the adoption of HMI touch enabled devices in markets such as consumer, wearable, IoT, automotive, industrial, medical and many other applications. -
General ManagerSilicon Turnkey Solutions, Inc. Apr 2017 - Jan 2019Mipitas, UsDivisional General Manager of STS (Silicon Turnkey Solutions, a Micross company).Reporting to the CEO of Micross.Responsible for all business aspects of the Division.www.sts-usa.com -
Vice President Of OperationsCorwil Technology Corporation Jan 2013 - Apr 2017Milpitas, California, UsReporting to the CEO / President Responsible for all Manufacturing Operations for Subcontract Assembly ServicesResponsibilities include Manufacturing Op, Process Engineering, Planning, Production control, Purchasing and Logistics.Full spectrum of Semiconductor Assembly Services from Back grind to final packaged assembly.ISO13485 compliant Medical Product Assembly, MIL-STD-883 / AS9100 compliant Military Product Assembly and Commercial Assembly. -
Corp. Vice President Manufacturing Operations / EngineeringLattice Semiconductor Mar 2011 - Dec 2011Hillsboro, Oregon, UsPosition reported to the CEO / PresidentRecently in charge of managing Business Continuity issues as a result of the Japan Earthquake impact on semiconductor raw materials and other supply chain partners.Responsible for All Product Operations including the following functions: Manufacturing Engineering, Foundry Operations, Planning and Production Control, and Manufacturing Operations. P&L responsibility at the Operations level.Technical and Business responsibility for all subcontract Wafer Foundries and all Assembly / Test suppliers.Lean Six Sigma Executive Team SponsorExecutive leader for Cu / Copper wire development and qualification of LQFP and BGA packages with two separate subcontract assembly partners.New CEO brought be back from Singapore that then wanted to bring in his own team and many of the Sr staff members including myself were replaced -
Corp. Vice President- Manufacturing Operations / Engineering & Gm Lattice SingaporeLattice Semiconductor Jan 2010 - Mar 2011Hillsboro, Oregon, UsReporting to the CEO / President.Started & Ran a new Singapore Operations center from Jan '10 to Feb '11. Ran Manufacturing Operations from Singapore for the first time in the companies history.Responsible for All Product Operations including the following functions: Manufacturing Engineering, Foundry Operations, Planning and Production Control, and Manufacturing Operations. P&L responsibility at the Operations level.Technical and Business responsibility for all subcontract Wafer Foundries and all Assembly / Test Partners.
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Vice President Manufacturing EngineeringLattice Semiconductor Aug 2004 - Dec 2009Hillsboro, Oregon, UsIn recognition for my capabilities, accomplishments, and commitment demonstrated in my previous Director role, I was promoted to Vice President.Additional Responsibilities vs. Director Role* Leadership role for Backend supplier overall strategy, selection and development of the partnerships for all technical and business issues.* Partial P&L responsibility at the Operations level.* Lead Operations team member for Lean 6 Sigma and our Product Life Cycle Management initiative. Manufacturing Engineering Six Sigma Champion.* Key manufacturing team leader for implementation of the companies ERP system.* Cost Estimation of all proposed new products for Feasibility. Led Product, Test and Package Engineers to transition new products from Development to High Volume manufacturing. Reported to Corporate VP Manufacturing Operations.
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Director - Product, Test And Package EngineeringLattice Semiconductor May 1997 - Aug 2004Hillsboro, Oregon, UsReported to Corporate VP Manufacturing Operations.Joined the group to consolidate management of the Product, Test and Package Engineering functions. The groups were in a state of disarray and high turnover and I first had to focus on getting things turned around and stabilized by earning the trust of the managers and engineers.After about 6 months, things were settled and responsibilities were expanded to include more and more of the business issues running the Assembly / Test Subcontractors.
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Director - Engineering And Product DevelopmentSt Microelectronics Sep 1993 - May 1997Geneva, Switzerland, ChRecruited to return to ST Micro to be a part of the New Ventures Group. Initial focus was on the partnership with Cyrix to second source x86 microprocessors with a new group and site in Phoenix.Responsible for Product, Test and Package Engineering. Which means I lead the backend development, characterization, qualification and sustaining of all products in our division.Set up backend Manufacturing Operations at the new Phoenix facility. Brought up products in the new wafer fabs in Phoenix and Crolles France.Reported to VP of Development / Engineering. -
Product / Test Engineering Manager, Front End OperationsZilog Feb 1993 - Aug 1993Milpitas, California, UsInitially recruited by a former supervisor from VLSI Technology but soon ended up reporting to the Vice President of OperationsWorked with VP of Engineering to implement daily "dead zone" wafer map analysis. Scribe line electrical characteristic differences and visual inspection differences to quickly identify source of low yields on Micro controller products. Doubled average wafer probe yields in 7 months. -
Manager Product & Test EngineeringSt Microelectronics Dec 1987 - Jan 1993Geneva, Switzerland, ChRecruited to SGS-Thomson in Carrolton Texas as a Senior Product Engineer. Was ready to try new things and a different type of company.Large Multinational company with tremendous internal manufacturing capability across the globe gave me great exposure to international cross functional team and project management.Worked on high volume products requiring Multi-Fab production from USA, Italy and FranceFirst in depth exposure to assembly and packaging field with internal assembly line for quick turn prototypes and assembly/ test facilities in Malta and Singapore.
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Product EngineerVlsi Technology Inc. Jun 1984 - Dec 1987First job out of College. Needed to de-ice after college and chose Silicon Valley. Selected Product Engineering due to it's mix of business and engineering. You are the CEO of your product. You must know everything about it, drive it's cost and manufacturing cycle time down while striving to improve quality.Experience with ROM's, SRAM, DPSRAM and high speed EEPROM's andMil-STD-883C qualified Memory and ASIC products.Helped with start-up of new Phoenix Engineering and Test facility.
Willy Bowman Skills
Willy Bowman Education Details
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Professional Training -
Cornell UniversityElectrical Engineering
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Kamehameha High SchoolCollege Prep
Frequently Asked Questions about Willy Bowman
What company does Willy Bowman work for?
Willy Bowman works for Atmosic Technologies
What is Willy Bowman's role at the current company?
Willy Bowman's current role is Vice President Operations.
What is Willy Bowman's email address?
Willy Bowman's email address is wi****@****put.com
What is Willy Bowman's direct phone number?
Willy Bowman's direct phone number is +140843*****
What schools did Willy Bowman attend?
Willy Bowman attended Professional Training, Cornell University, Kamehameha High School.
What skills is Willy Bowman known for?
Willy Bowman has skills like Semiconductors, Cross Functional Team Leadership, Engineering Management, Manufacturing, Six Sigma, Product Engineering, Lean Manufacturing, Yield, Supply Chain Management, Negotiation, Operations Management, Spc.
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