Wilson Chang
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Wilson Chang Email & Phone Number

Senior Global Account Manager at Gold Circuit Electronics
Location: Austin, Texas, United States 8 work roles 1 school
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Current company
Role
Senior Global Account Manager
Location
Austin, Texas, United States
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Who is Wilson Chang? Overview

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Quick answer

Wilson Chang is listed as Senior Global Account Manager at Gold Circuit Electronics, a with 185 employees, based in Austin, Texas, United States. AeroLeads shows a matched LinkedIn profile for Wilson Chang.

Wilson Chang previously worked as Business Development and Account Leader at Dupont and Business development leader at 台灣杜邦股份有限公司. Wilson Chang holds 大學, 化學 from 清華大學.

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Gold Circuit Electronics

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Profile bio

About Wilson Chang

Expert of NPI and PCB design for manufacturing with Solid Technical Background to Offer Solution to Your Design◄ PCB Process Knowledge | Relationship Maintenance | Problem Solving | New Product Introduction |• 10 years of experience in substrate design for manufacturing and NPI project management,5 years of experience in FPC industry for business development and account management.• Succussed to transform ideas into mature products and strong background in FPC/substrate quality and engineering for NPI projects.• Experienced with Process Optimization, Statistical Data Analysis, Process Design, Technical Project Management, PCB Processing, Specification Review and Revision.• Demonstrated a strong connecting link between suppliers, internal and customers, good at delivering clear instructions and solid solutions. Passionate in relationships cultivating and maintaining for project and business development.

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Wilson Chang's current company

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Gold Circuit Electronics
Gold Circuit Electronics
Senior Global Account Manager
Austin, TX, US
Website
Employees
185
AeroLeads page
8 roles

Wilson Chang work experience

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Business Development And Account Leader

Austin, Texas, United States

Business Development Leader

Taoyuan City, Taiwan

- New market and product scouting■ Developed the next generation product for low ion migration adhesive and coverlay to meet high current and fine-line requirement. ■ Delivered clear direction for product development and competition landscape for pitch pack- Business development with key suppliers and FPC makers■ Partnered with supplier to develop new FCCL with low profile Cu to meet new design requirement.■ Succeeded to solve FPC maker process pain point and spec in low loss material for new generation models.

Feb 2021 - Sep 2023

Account Manager

Taoyuan City, Taiwan

- Key account management for top customer■ Surpassed business target($40m) of key accounts in Taiwan and China.- Promoted new product to target account.■ Earned $150million business opportunity for 2019 growth by working with engineering/ product line/ BD team.■ Won new application for R&D project to get $2million revenue in 2018.- Set up next year business strategy and put into practice.■ Built 2018 business plan and get 15% revenue growth for C customer.

Sep 2017 - Feb 2021

Product Manager

- Set up 3 years FCCSP product roadmap for internal R&D engineering development- Ensured products met or exceeded client schedule and expectations■ Established core team from quality, process integration engineer, R&D, designer and sales to provide better service for M customer.- Excelled at marketing information gathering and summarizing feedback and requirements■ Collected all competitors’ material for M customer product to improve internal NPI low yield issue(only 25% yield).- Outperformed communication between SATs, end-customer and sales.■ Worked with Taiwan top 1 design house and worldwide top 3 assembly house as main contact window and internal decision maker for 2018 new AP project- Focus on FCCSP and W/B substrate trend for new package architecture.■ Involved in 2018 high end AP project of China top 1 cell phone company with new package and material structure as an internal coordinator.

Feb 2017 - Sep 2017

Chief Product Engineer

Taoyuan City, Taiwan

- Building up substrate design rule with customer/Internal- Improving internal quality issue to achieve yield target- Providing engineering feedback and regular design review to customer- Handling technical support and solution for customer process requirement.- Managing internal process/quality improvement and cost down project.- Establishing internal DFM process SOP and system.

Oct 2010 - Feb 2017

Senior Sales Engineer

Taoyuan City, Taiwan

- Creating new customer for potential market- Coordinating the operations of different department to serve customer- Maintaining business for top customer- Setting annual business plan and target

Dec 2007 - Oct 2010
Team & coworkers

Colleagues at Gold Circuit Electronics

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1 education record

Wilson Chang education

  • 清華大學
    清華大學
    化學
FAQ

Frequently asked questions about Wilson Chang

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What company does Wilson Chang work for?

Wilson Chang works for Gold Circuit Electronics.

What is Wilson Chang's role at Gold Circuit Electronics?

Wilson Chang is listed as Senior Global Account Manager at Gold Circuit Electronics.

Where is Wilson Chang based?

Wilson Chang is based in Austin, Texas, United States while working with Gold Circuit Electronics.

What companies has Wilson Chang worked for?

Wilson Chang has worked for Gold Circuit Electronics, Dupont, 台灣杜邦股份有限公司, Kinsus Interconnect Technology Corp., and Industrial Technology Research Institute (Itri)(工業技術研究院, 工研院).

Who are Wilson Chang's colleagues at Gold Circuit Electronics?

Wilson Chang's colleagues at Gold Circuit Electronics include Iliang Lin, Danny Wang, Andrew Pickles, Richard Hipolito, and 刁志鹏.

How can I contact Wilson Chang?

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What schools did Wilson Chang attend?

Wilson Chang holds 大學, 化學 from 清華大學.

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