Win Giles Email & Phone Number

Hutchinson Technology Incorporated, a TDK Group Company, specializes in the design and manufacture of close-tolerance products that require chemical, mechanical and electronic technologies. As a leader in the electronics industry, TDK's portfolio includes electronic components, products under the brands TDK and EPCOS, power supplies, magnetic application products, energy devices, and more. TDK has a world-wide network of design and manufacturing locations.

Vice President Operations, VP Engineering, Director Operations - On an interim basis, I provide Operational consulting services to small and mid sized companies leading business process and manufacturing process improvement in semiconductor, hi-tech manufacturing, electrical or electronic manufacturing, component manufacturing, additive manufacturing, 3D printing, control systems and workflow automation to drive continuous improvement strategies and cost reduction.Clients Hire Me To:• Develop and implement long-term business strategies• Develop and implement required business processes• Utilize Lean and 6-Sigma methodologies to drive continuous improvement• Mentor business leaders Contact me at winthropgiles@gmail.com or 952.454.4583

Fremont, Ca, Us

Reported to the Sr. Vice President of Operations, as Head of Manufacturing Operations and Plant Manager at Seagate a leading manufacturer of hard disk drives serving all segments of the data storage market. Led Recording Head Operations in Bloomington, MN consisting of ~700 people in total including 6 Sr Director level direct reports, 180 professionals, 170 technician/support personnel, and ~350 operators (direct labor). As Head of Operations, I led all aspects of Operations across the site including Manufacturing, Engineering, Facilities, EH&S, Finance, Materials, HR, IT, Quality and total P&L responsibility with annual budget of ~$150M. Key Continuous Improvement Accomplishments:► Drove continuous improvement in manufacturing processes, capability, quality, and performance through use of Lean / 6 sigma, 8D, and advanced factory control systems which realized significant improvements in yields, cycle times, and capital costs.Recognized with Advanced Level Baldrige Award:► Led continuous improvement in business processes and organizational alignment resulting in a site Baldrige Application and assessment conducted by the Performance Excellence Network (PEN) where we were recognized with the Baldrige Advancement Level Award for Business Excellence in April 2015.Key Leadership Accomplishments:►Managed plant expansion and build-out of new facilities including large, Class 100 clean room. Completed project on-time and under-budget, enabling operational flexibility between sites.► Led site, successfully, achieving the Electronic Industry Citizenship Coalition (EICC) certification in 2014 and certification in ISO 9001.Key Technology Leadership Accomplishments: ► Drove site operations strategy and alignment to product & technology roadmap enabling cost effective delivery of new technology to production and improved efficiency.

Fremont, Ca, Us

Reported to VP Operations and led a process engineering team of 140+ people consisting of 12 managers/directors, 92 professionals, and 40 technicians.Key Continuous Improvement Accomplishments:► Chief architect in development & deployment of Advanced Process Control Systems resulting in improved process capability, reduced capital spending, and improved product quality and performance. This system includes: Statistical Process Control, Automated Process Control, Tool Data Collection/Control, Fault Detection, and event-driven automated workflow processes. Key Technology Leadership Accomplishments:► Responsible for specifying, selecting, qualifying, and launching a new 200mm wafer toolset into volume production manufacturing. Seagate was the first in the Data Storage Industry to do this which required development partnership with strategic capital equipment suppliers. This project was completed in two factories over the course of 4 years and had a worldwide budget of $600M+.Key Leadership Accomplishments:► Delivered a wafer consignment business model with SAE China which enabled needed worldwide operational flexibility for Seagate Supply Chain and avoided significant capital expenditures.

Fremont, Ca, Us

Reported to VP Operations and led a process engineering team of 130+ managers, engineers, and technicians. 2 year international assignment.Key Technology Leadership Accomplishments:► Formed a Manufacturing Process Integration (MPI) Group in Ireland dedicated to integrating new technology/processes in to volume production. This enabled 2nd site equivalency in process and performance within 1 quarter of production launch which in turn provided operational flexibility to split schedule between the sites as neededKey Leadership Accomplishments:► Recognized for increasing factory capacity while improving process and equipment capability by leading a major factory conversion from 4.5” to 6” round wafer format.

Fremont, Ca, Us

Reported to Sr Director Operations. Promoted to successive operational leadership roles within Wafer Process Engineering.Key Leadership Accomplishments:► Formed and led new Process Integration Group within Wafer Process Engineering.Key Technology Leadership Accomplishments:► Led a development “task force” team consisting of 30 engineers and technicians chartered with delivering the first spin valve based GMR devices into production.► Transferred 6-7Gb/in2 and 15Gb/in2 recording head technology into volume manufacturing in both MN and Ireland production wafer facilities.► Led a wafer process team that supported Tape products and transferred all these products to Seagate’s recording head operations in Northern Ireland in June '98.

Reported to Vice President, Operations in two year international assignment based in Singapore to lead product design, development, and integration into the drive for customers based in far east resulting in increased market share. Key Leadership Accomplishments:► Coordinated account activities with Applied Magnetics manufacturing in Seoul, South Korea as well as with customers based in both Japan and Singapore optimizing product performance.Key Technology Leadership Accomplishments:► Project/Product Management leadership in qualifying several new products with customers in Japan & Singapore followed by managing volume production ramp.

Reported to Director of Engineering as a Tape Head Design & Manufacturing Engineering Lead.Key Leadership & Technical Accomplishments:► Led joint project with Storage-Tek to build a 3.4" square Tape wafer line in STK's Louisville, CO facility to support STK & Applied Magnetics tape wafer manufacturing requirements.► Worked with the division VP to coordinate the above activity with the acquisition of the division by Seagate.