Jaroslaw "Jerry" Winniczek Email & Phone Number

Ca, Us

Applying computer vision algorithms and machine learning to medical photography and videography for asynchronous tele-medicine. Invented color analysis, image segmentation and classification algorithms of wound photos to monitor healing for a variety of disorders. Developed imaging techniques to classify viability of donor organs for transplantation. Algorithms for measurement of movement in human limbs, for: detection of neurological problems, and post-operative recovery.

Redmond, Washington, Us

Contract position through Embedded Resource GroupDeveloped test procedures and image processing algorithms for 3D cameras. Performance statistics, Feature classification, machine vision and machine learning. Distilling terabytes of data into actionable metrics which resulted in advancement in performance of 3D cameras for variety of applications. Matlab. IR Imaging, OpenCV

• Developed and methods algorithms for signal classification – decision trees, SVM• Evolved analysis methods and algorithms for classification and identification of compounds from of spectra. Spectral decomposition, regression. • Conceiving algorithms for rating and predicting the likability (subjective quality) of photographic images using machine learning: SVM, Trees

Fremont, Ca, Us

Key member of technical staff developing state-of-the-art equipment and processes for semiconductor wafer processing. Provided expertise in diverse areas of R&D, engineering and product support for a multi-billion dollar corporation.• Developed methods for process tool fault detection; OES, RF Sensors, Algorithm Development, Multi-variate analysis, Machine Learning, Machine Vision, Instrument control, Matlab, C/C++, Python, SQL and VisualBasic.• Developed sensor based Machine Learning algorithms which resulted in increasing spacer etch throughput by over 20% for major customer. Tree Regression & Classification, SVM, PLS• Characterized etch (RIE) results with SEM, confocal microscopy, spectral optical ellipsometry for thin film measurement, TEM, EDX. Statistical methods for process monitoring and correction: SPC and Chemometrics, Machine Learning, Design of Experiments • Pioneered development of reactors and processes for TSV (3DIC) and MEMS etch (ICP and Microwave). Ensured acceptance of equipment with key customers, established a path to majority market share. Developed high etch rate alternatives to Bosch process, conducted effective demos employing DOE methods.• Patented processes for post ion implant strip with very low silicon recess; photoresist removal with plasma clean. • Introduced new process chambers and processes for: ICP etch of dielectric films and confined plasma metal etch, leading to etch tool acquisition by several key customers.

Fremont, California, Us

Staff Technologist developing state-of-the-art equipment and methods for semiconductor wafer processing. Provide expertise in diverse areas of R&D, sustaining engineering and product support • Delivered new fully characterized plasma etch, strip and clean system to key customers, ahead of schedule, with improved throughput and process performance, triple MTBF & MTBM.• Invented and drove to product a novel endpoint detection algorithm and system - patented. Designed optical spectroscopy hardware. Drove and shaped corporate wide endpoint program. SVD, Factor Analysis• Developed methods for process tool fault detection; OES, RF Sensors, Algorithm Development, Multi-variate analysis, Machine Learning, Instrument control, Matlab, C/C++, and VisualBasic.– Diagnosed and resolved causes of process drift, facilitating product release. Developed spectroscopic diagnostic methods and algorithms for process optimization and hardware fault detection. Partial Least Squares • Initiated, designed and managed a project for a unique dry copper etch and residue cleaning technology; vapor phase metal coordination compound chemistry. Achieved high Cu etch rates in gas phase, providing a gateway for productization.

Fremont, Ca, Us

Staff Scientist developing state-of-the-art equipment and methods for semiconductor wafer processing. • Invented plasma pulsing techniques for improvement of selectivity and reduction of damage.• Introduced new process chambers and processes for ICP etch of dielectric films, and confined plasma metal etch, leading to etch tool acquisition by several key customers. • Developed methods for process tool fault detection; OES, RF Sensors, Algorithm Development, Multi-variate analysis, Process Endpoint systems.• Drove corporate wide endpoint program.• Plasma chacterization with energy resolved mass spectrometry (IED Ion Energy Distribution), Langmuir probe analysis, high resolution optical spectroscopy

Upton, Ny, Us

• Investigated spectroscopy, geometric properties of molecules produced by laser photo-fragmentation, and molecules scattered from surfaces. Developed methods for determining molecular orientation after a chemical reaction. • Developed techniques for probing these properties. Designed Time-of-Flight mass spectrometer and electron energy analyzer. Designed a chamber for probing laser-surface interactions.• Modeled optical spectra from principles of quantum mechanics to ascertain mechanisms of chemical dissociation. GUI development, Least Squares fitting, Optimization

Doctor Of Philosophy (Phd), Chemical Physics

Bachelor Of Arts (Ba), Chemistry

Post Graduate, Physical Chemistry