Jaroslaw

Jaroslaw "Jerry" Winniczek Email and Phone Number

Computer Vision and Machine Learning applied to Medical Photos and Videos @ CaptureProof
Jaroslaw "Jerry" Winniczek's Location
Daly City, California, United States, United States
Jaroslaw "Jerry" Winniczek's Contact Details

Jaroslaw "Jerry" Winniczek work email

Jaroslaw "Jerry" Winniczek personal email

n/a
About Jaroslaw "Jerry" Winniczek

Diverse Technologist and Scientist with extensive experience in several high technology industries. Firm understanding of details and big picture thriving on initiating novel projects through multi-directional thinking and creativity. Focused on problem-solving and root cause analysis. Driven by “why” analysis using science mathematics to push projects through to completion.►RESEARCH & DEVELOPMENT: Invented novel technologies in order to boost overall performance processing equipment, prediction, and machine learning algorithms. ►STATSICAL ANALYSIS, MODELING & MACHINE LEARNING: Developed methods, diagnostic and computational, for modeling of processes and process state. Invented sensors and algorithms for detection of significant process events. Invented machine vision system for: detecting defects on product; characterization of 3D (depth) cameras; medical imaging application., . Developed sensors & ML algorithms to increase manufacturing throughput by 20%. Modeled process behavior to understand the underlying chemistry and physics to improve performance ►PROJECT MANAGEMENT: Architect for medical computer vision systems. Coordinated product development with vendors to improve performance by over 100% and reduce cost by 20%. Etch system development for MEMS with 300% improvement in performance. Key Competencies:• Machine Learning and Prediction• Data Analysis and Algorithms• Machine Vision – Image Analysis• Project Management• Product Development• Customer Application• Equipment Development• Etch – RIE, TSV, MEMS• Thin Film Metrology• Computational Chemical Physics • Process Technology - Development and Diagnostics• Thin Films• Process and Plasma DiagnosticsContact Info: Jerry.Winniczek@gmail.com

Jaroslaw "Jerry" Winniczek's Current Company Details
CaptureProof

Captureproof

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Computer Vision and Machine Learning applied to Medical Photos and Videos
Jaroslaw "Jerry" Winniczek Work Experience Details
  • Captureproof
    Computer Vision
    Captureproof Dec 2016 - Present
    Ca, Us
    Applying computer vision algorithms and machine learning to medical photography and videography for asynchronous tele-medicine. Invented color analysis, image segmentation and classification algorithms of wound photos to monitor healing for a variety of disorders. Developed imaging techniques to classify viability of donor organs for transplantation. Algorithms for measurement of movement in human limbs, for: detection of neurological problems, and post-operative recovery.
  • Microsoft
    Test And Data Software Engineer
    Microsoft May 2015 - Dec 2016
    Redmond, Washington, Us
    Contract position through Embedded Resource GroupDeveloped test procedures and image processing algorithms for 3D cameras. Performance statistics, Feature classification, machine vision and machine learning. Distilling terabytes of data into actionable metrics which resulted in advancement in performance of 3D cameras for variety of applications. Matlab. IR Imaging, OpenCV
  • Consultant
    Data Scientist
    Consultant Oct 2013 - May 2015
    • Developed and methods algorithms for signal classification – decision trees, SVM• Evolved analysis methods and algorithms for classification and identification of compounds from of spectra. Spectral decomposition, regression. • Conceiving algorithms for rating and predicting the likability (subjective quality) of photographic images using machine learning: SVM, Trees
  • Lam Research
    Member Of Technical Staff
    Lam Research 2004 - 2013
    Fremont, Ca, Us
    Key member of technical staff developing state-of-the-art equipment and processes for semiconductor wafer processing. Provided expertise in diverse areas of R&D, engineering and product support for a multi-billion dollar corporation.• Developed methods for process tool fault detection; OES, RF Sensors, Algorithm Development, Multi-variate analysis, Machine Learning, Machine Vision, Instrument control, Matlab, C/C++, Python, SQL and VisualBasic.• Developed sensor based Machine Learning algorithms which resulted in increasing spacer etch throughput by over 20% for major customer. Tree Regression & Classification, SVM, PLS• Characterized etch (RIE) results with SEM, confocal microscopy, spectral optical ellipsometry for thin film measurement, TEM, EDX. Statistical methods for process monitoring and correction: SPC and Chemometrics, Machine Learning, Design of Experiments • Pioneered development of reactors and processes for TSV (3DIC) and MEMS etch (ICP and Microwave). Ensured acceptance of equipment with key customers, established a path to majority market share. Developed high etch rate alternatives to Bosch process, conducted effective demos employing DOE methods.• Patented processes for post ion implant strip with very low silicon recess; photoresist removal with plasma clean. • Introduced new process chambers and processes for: ICP etch of dielectric films and confined plasma metal etch, leading to etch tool acquisition by several key customers.
  • Novellus Systems
    Staff Technologist
    Novellus Systems 1999 - 2003
    Fremont, California, Us
    Staff Technologist developing state-of-the-art equipment and methods for semiconductor wafer processing. Provide expertise in diverse areas of R&D, sustaining engineering and product support • Delivered new fully characterized plasma etch, strip and clean system to key customers, ahead of schedule, with improved throughput and process performance, triple MTBF & MTBM.• Invented and drove to product a novel endpoint detection algorithm and system - patented. Designed optical spectroscopy hardware. Drove and shaped corporate wide endpoint program. SVD, Factor Analysis• Developed methods for process tool fault detection; OES, RF Sensors, Algorithm Development, Multi-variate analysis, Machine Learning, Instrument control, Matlab, C/C++, and VisualBasic.– Diagnosed and resolved causes of process drift, facilitating product release. Developed spectroscopic diagnostic methods and algorithms for process optimization and hardware fault detection. Partial Least Squares • Initiated, designed and managed a project for a unique dry copper etch and residue cleaning technology; vapor phase metal coordination compound chemistry. Achieved high Cu etch rates in gas phase, providing a gateway for productization.
  • Lam Research
    Staff Scientist
    Lam Research 1990 - 1999
    Fremont, Ca, Us
    Staff Scientist developing state-of-the-art equipment and methods for semiconductor wafer processing. • Invented plasma pulsing techniques for improvement of selectivity and reduction of damage.• Introduced new process chambers and processes for ICP etch of dielectric films, and confined plasma metal etch, leading to etch tool acquisition by several key customers. • Developed methods for process tool fault detection; OES, RF Sensors, Algorithm Development, Multi-variate analysis, Process Endpoint systems.• Drove corporate wide endpoint program.• Plasma chacterization with energy resolved mass spectrometry (IED Ion Energy Distribution), Langmuir probe analysis, high resolution optical spectroscopy
  • Brookhaven National Laboratory
    Research Associate
    Brookhaven National Laboratory 1987 - 1990
    Upton, Ny, Us
    • Investigated spectroscopy, geometric properties of molecules produced by laser photo-fragmentation, and molecules scattered from surfaces. Developed methods for determining molecular orientation after a chemical reaction. • Developed techniques for probing these properties. Designed Time-of-Flight mass spectrometer and electron energy analyzer. Designed a chamber for probing laser-surface interactions.• Modeled optical spectra from principles of quantum mechanics to ascertain mechanisms of chemical dissociation. GUI development, Least Squares fitting, Optimization

Jaroslaw "Jerry" Winniczek Skills

Semiconductors Thin Films Design Of Experiments Plasma Etch Semiconductor Industry Plasma Physics R&d Silicon Failure Analysis Process Integration Metrology Mems Sensors Electronics Product Engineering Physics Materials Science Characterization Rf Spectroscopy Radio Frequency Classification And Regression Python Machine Learning Sql Nanotechnology Laser Physics Matlab Ion Beams Mass Spectrometry Molecular Dynamics Multivariate Analysis Chemometrics Thin Film Characterization C/c++ Visual Basic Algorithms Vapor Phase Metal Chemistry Engineering Management Photography Etching Cvd Ellipsometry Atomic Layer Deposition Data Analysis Research Statistics Computer Vision Deep Learning Scikit Learn Spc Doe Hdr Photography

Jaroslaw "Jerry" Winniczek Education Details

  • Caltech
    Caltech
    Chemical Physics
  • Case Western Reserve University
    Case Western Reserve University
    Chemistry
  • University Of Rochester
    University Of Rochester
    Physical Chemistry

Frequently Asked Questions about Jaroslaw "Jerry" Winniczek

What company does Jaroslaw "Jerry" Winniczek work for?

Jaroslaw "Jerry" Winniczek works for Captureproof

What is Jaroslaw "Jerry" Winniczek's role at the current company?

Jaroslaw "Jerry" Winniczek's current role is Computer Vision and Machine Learning applied to Medical Photos and Videos.

What is Jaroslaw "Jerry" Winniczek's email address?

Jaroslaw "Jerry" Winniczek's email address is je****@****mrc.com

What schools did Jaroslaw "Jerry" Winniczek attend?

Jaroslaw "Jerry" Winniczek attended Caltech, Case Western Reserve University, University Of Rochester.

What are some of Jaroslaw "Jerry" Winniczek's interests?

Jaroslaw "Jerry" Winniczek has interest in Animal Welfare, Education, Environment, Science And Technology.

What skills is Jaroslaw "Jerry" Winniczek known for?

Jaroslaw "Jerry" Winniczek has skills like Semiconductors, Thin Films, Design Of Experiments, Plasma Etch, Semiconductor Industry, Plasma Physics, R&d, Silicon, Failure Analysis, Process Integration, Metrology, Mems.

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