Wonbae Bang Email & Phone Number

Incheon, South Korea

Advanced package development in R&D center- CIS package development project leader Manage a team of Managers, Directors and Senior Directors, as well as up to 3 ~ 5 customer- Single layer routable Molded Lead frame package development- Molded substrate package development with single layer / multi layer substrate (Successful launching HVM with 98% high yield)- New pre-stack package development and transfer it to factory- Thin fan in POP package development- Completed WLFO development with successful transfer to factory- Completed new Interposer POP package development (Successful launching HVM with 99% high yield)- Documentation for HVM such as APQP , FMEA and control plan- New packaging cost modeling- Define assembly BOM, process, troubleshoot and provide sustaining support on packaging issues

Seoul, South Korea

- Lead frame design for MQFP, L/TQFP- Substrate design for CSP, flip chip CSP, fpfp(Fine pitch FlipChip)CSP- Photo mask(bumping) design for WLCSP, solder bumping, Cu pillar, TSV, WLFO, etc.- Design guideline set up for various packages.- New package development project like WLFO, Passive on glass, etc.- Design tool: Cadence APD, Sigrity UPD, Tanner L-Edit, AutoCAD, CAM350.

Master Of Engineering - Meng, Materials Engineering

Bachelor'S Degree, Mechanical Engineering