Xingchen Li
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Xingchen Li Email & Phone Number

IC Package Design Engineer at Apple
Location: Atlanta Metropolitan Area, United States, United States 8 work roles 3 schools
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Current company
Role
IC Package Design Engineer
Location
Atlanta Metropolitan Area, United States, United States

Who is Xingchen Li? Overview

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Quick answer

Xingchen Li is listed as IC Package Design Engineer at Apple, based in Atlanta Metropolitan Area, United States, United States. AeroLeads shows a matched LinkedIn profile for Xingchen Li.

Xingchen Li previously worked as Graduate Research Assistant at Georgia Institute Of Technology and MCM Design Engineer at Skyworks Solutions, Inc.. Xingchen Li holds Doctor Of Philosophy - Phd, Electrical And Computer Engineering, Cgpa: 3.9/4.0 from Georgia Institute Of Technology.

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Apple

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About Xingchen Li

Xingchen Li is a IC Package Design Engineer at Apple. They is proficient in Russian and English.

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Apple
Apple
IC Package Design Engineer
Santa Clara, CA, US
AeroLeads page
8 roles

Xingchen Li work experience

A career timeline built from the work history available for this profile.

Ic Package Design Engineer

Santa Clara, CA, US

Graduate Research Assistant

Current

Atlanta, Georgia, United States

RF circuit and system design, packaging for RF/microwave models.Advisor: Prof. Madhavan Swaminathan- Packaging designs for RF, mmWave, D-band and G-band applications.- Worked with 3D Systems Packaging Research Center

Sep 2021 - Present

Mcm Design Engineer

San Jose, California, United States

MCM front-end design for PAMiD module.2G, LTE LMB and MHB simulation and verification.Hands on experience on RxBN, ACLR, harmonics and de-sense tuning and debugging.

May 2024 - Aug 2024

Research Associate/Assistant Intern

State College, Pennsylvania, United States

May 2023 - Aug 2023

Graduate Teaching Assistant

Atlanta, Georgia, United States

ECE3025 (Electromagnetics), ECE 2040 (Circuit Analysis), ECE 3741(Instrumentation and Electronics Laboratory)

Aug 2020 - Jul 2021

Hardware Engineer

Tianjin, China

Hardware Engineer Intern, in Division 4, AE Hardware Department- Testing and optimizing baseband and RF front-end modules for wireless key and broadcast systems in civil automotive applications;- On-board antenna design for handset applications in automobiles;- RKE, PKE, BCM ANT+Receiver, and ICGM BLE+4G+GPS

May 2020 - Jul 2020

Undergraduate Research Assistant

Tianjin, China

mmWave and RF circuits and systems.Advisor: Prof. Kaixue Ma- Q-enhancement approaches for resonators, multiple-coupled resonator modelings;- Microwave filter synthesis.

Sep 2018 - Jun 2020

Research Intern

Virtual

GHz microfluidic chip and peripheral circuits.Advisor: Prof. Mark A. Reed- Array control to GHz microfluidic chip for micro particle trapping and filtering;- GHz power division system for distributing power to elements in the array.

Jul 2019 - Sep 2019
3 education records

Xingchen Li education

Doctor Of Philosophy - Phd, Electrical And Computer Engineering, Cgpa: 3.9/4.0

Major tracks: Electromagnetics, microwave engineering, electronic packaging, and integrated circuit design

Bachelor Of Engineering - Be, Microelectronic, Electrical Engineering, 3.94/4.00

- Ranked top 1 out of 90+ peers - Highest Honored Degree

Bachelor Of Economic, Finance, General

Activities and Societies: Minor degree.

FAQ

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What company does Xingchen Li work for?

Xingchen Li works for Apple.

What is Xingchen Li's role at Apple?

Xingchen Li is listed as IC Package Design Engineer at Apple.

Where is Xingchen Li based?

Xingchen Li is based in Atlanta Metropolitan Area, United States, United States while working with Apple.

What companies has Xingchen Li worked for?

Xingchen Li has worked for Apple, Georgia Institute Of Technology, Skyworks Solutions, Inc., Penn State University, and Hirain Technologies.

How can I contact Xingchen Li?

You can use AeroLeads to view verified contact signals for Xingchen Li at Apple, including work email, phone, and LinkedIn data when available.

What schools did Xingchen Li attend?

Xingchen Li holds Doctor Of Philosophy - Phd, Electrical And Computer Engineering, Cgpa: 3.9/4.0 from Georgia Institute Of Technology.

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