Leading ST Global Power Package R&D team in China, France and Italy.

Leading both Operation Team and Package R&D team.Power Module Operation Team:- Manufacturing for IPM, HPD, HB Module for EV/HEV and Industrial applications- More than 200 people team inculding production, maintenance and process engineering functions. Power Module Package R&D Team:- Package R&D for *IPM, DIP & SMD version, 1A~50A, Industrial & Automotive Grade*Plastic Module, Hybridpack Drive module with Si Based and SIC based.*Molded Module, Half bridge,… Show more Leading both Operation Team and Package R&D team.Power Module Operation Team:- Manufacturing for IPM, HPD, HB Module for EV/HEV and Industrial applications- More than 200 people team inculding production, maintenance and process engineering functions. Power Module Package R&D Team:- Package R&D for *IPM, DIP & SMD version, 1A~50A, Industrial & Automotive Grade*Plastic Module, Hybridpack Drive module with Si Based and SIC based.*Molded Module, Half bridge, Single Side cooling, Dual Side Cooling module with Direct Cooling and Indirect Cooling, based on Sic Gen3 Mosfet.- Leading ST China Power Module R&D Team (Named as APPLab - Advanced Power Package Lab), with Design, Simulation, Process development, PMO and an R&D Pilot Line.- Managing R&D Pilot line. Show less

WLCSP and then move to IPM

- Handling WLCSP Process Engineering- Established Advaned Wafer Sawing Center in China Assy Plant