Xiaoyu Du work email
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Xiaoyu Du personal email
• CMOS image sensor (CIS) pixel R&D experience in industry: automotive HDR sensor, sub-micron small pixels, CIS for consumer electronics.• Doctoral research experience in novel band-engineered III-V MWIR photodetectors, encompassing epitaxial design, wafer-level fabrication, and characterization.• Proficiency in the characterization and modeling of multiple device types, such as CIS, IR photodetectors, photonic cavity devices, BJT, and high-power nLDMOS.• Comprehensive knowledge of optics, including optical system/lens design, Code V, Lumerical FDTD, and radiometry, as well as optoelectronic devices, semiconductor physics, electronic circuits, and digital signal/image processing.• Skilled in programming with MATLAB and Python: internal tools, UI, lab hardware control, data processing automation, data visulization.
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Pixel Development EngineerApple Sep 2024 - PresentCupertino, California, Us• Develop next generation camera products and features. -
Sr. Staff EngineerGigadevice Semiconductor Inc. May 2022 - Sep 2024Beijing, Cn• Deeply engaged in sub-micron small pixel developments for 50 mega CIS: improving pixel design, optics, and processing.• Led and managed the CIS pixel characterization initiative, overseeing the development of test set-ups, hardware, and software. • Developed Python-based characterization software and implemented efficient test automation processes for streamlined data collection and analysis.• Conducted wafer-level optical simulations utilizing Lumerical FDTD to support the CIS pixel design. -
Sr. Product Characterization EngineerOmnivision Jul 2021 - Apr 2022Santa Clara, Ca, Us• Led the build-up of EMVA1288 (European Machine Vision Association) standard compliance datasheets, establishing comprehensive test capabilities, procedures, and streamlined data acquisition and processing methods. • Successfully generated and formatted compliance reports for EMVA1288 results, ensuring adherence to industry standards.• Key contributor to the release of two acclaimed automotive CIS products, OX03C10 and OX03F10. -
Product Characterization EngineerOmnivision Jul 2018 - Jul 2021Santa Clara, Ca, Us• Significantly contributed to the research and development of Automotive HDR CIS pixels from NTO to MP stages.• Conducted thorough pixel characterization for accurate performance assessment.• Played a key role in image evaluation and contributed to the development of efficient test set-ups and automation processes.• Successfully resolved root causes of issues, effectively managed resources, and collaborated with cross-functional teams while maintaining clear communication.• Key contributor to the release of several acclaimed automotive CIS products, including OX03A10/ OX03A1S/OX03A2S, OX01E10/OX01F10, OX01D10.
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Research AssistantUniversity Of Rochester Sep 2013 - Aug 2018Rochester, Ny, UsBand-engineered Barrier III-V MWIR Photodetectors• Designed epitaxial structures of nBn photodetectors, and unipolar barrier detectors.• Routinely fabricated photodetectors using advanced semiconductor fabrication technologies, including lithography, deposition, etching, and lift-off.• Characterized devices' electrical and optical properties on the wafer level.• Collected data, conducted data analysis, and developed models to assess devices' properties and performance. -
Research AssistantUniversity Of Rochester Sep 2015 - Mar 2016Rochester, Ny, UsNano IR Detector Fabrication• Utilized advanced fabrication and metrology tools, including E-beam lithography, SEM, and AFM, to fabricate nano-structure detectors for potential optical antenna applications.
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Lens Design Class And ProjectsUniversity Of Rochester Jan 2015 - May 2015Rochester, Ny, Us• Completed a project-oriented advanced course with a focus on comprehensive knowledge of aberration theory, thin lens Gsums, aspheres, GRIN lenses, diffractive lenses, and more.• Designed a lens for a MWIR detection system.• Designed an underwater fisheye lens for a DSLR camera.
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Research And Development InternOn Semiconductor Jun 2017 - Aug 2017Scottsdale, Arizona, Us• Developed a system for Clamped Inductive Switching energy capability measurements for power MOS devices.• Designed circuits and boards for package-level and wafer-level measurements.• Collaborated and coordinated with a team at a different site to enable the measurements across company sites.• Analyzed data and modeled the energy capabilities of different devices. -
Device Characterization InternOn Semiconductor Jun 2015 - Aug 2015Scottsdale, Arizona, Us• Characterized high-power nLDMOS devices on the wafer level.• Proposed a new pulse stress method to study hot-carrier injections.• Collected data and modeled devices' degradation to define devices' lifetime.
Xiaoyu Du Skills
Xiaoyu Du Education Details
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University Of RochesterElectrical And Electronics Engineering -
University Of RochesterElectrical And Electronics Engineering
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Beijing Institute Of TechnologyOptical And Electronics Engineering
Frequently Asked Questions about Xiaoyu Du
What company does Xiaoyu Du work for?
Xiaoyu Du works for Apple
What is Xiaoyu Du's role at the current company?
Xiaoyu Du's current role is Camera Hardware Engineer at Apple | Ph.D. |.
What is Xiaoyu Du's email address?
Xiaoyu Du's email address is xd****@****ovt.com
What schools did Xiaoyu Du attend?
Xiaoyu Du attended University Of Rochester, University Of Rochester, Beijing Institute Of Technology.
What are some of Xiaoyu Du's interests?
Xiaoyu Du has interest in Science And Technology.
What skills is Xiaoyu Du known for?
Xiaoyu Du has skills like Matlab, Optics, Simulations, Semiconductors, Characterization, Afm, Microsoft Office, Field Programmable Gate Arrays, Research.
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