• Developed automated data acquisition and analysis systems using R, Excel VBA and Access, for production line yield and reliability data analysis, as well as to drive next generation product introduction (NPI), with tightened electrical, optical, and reliability specifications while maintaining/improving production yield;• Utilized SPC and GR&R to ensure the accuracy and consistency of manual and automated electrical and optical test stations;• In charge of designing/improving testing infrastructures for various devices and form factors, to enable high-throughput wafer qualification, on-going reliability testing (ORT) of finished products from contract manufacturers (CM), as well as highly accelerated life tests (HALT). Recorded/analyzed test data for over 1/4 billion device-hours;• Developed predicative models to project LED lifetime for operating conditions from accelerated aging tests, as well as using Weibull statistical analysis and Six Sigma principles to evaluate overall product reliability with industry-leading performance;• Directed the new product qualification planning and execution during product development and launch, including temperature, humidity, ESD, vibration, power cycle, etc.;• Qualified new components and material from suppliers to ensure quality and reliability;• Performed root-cause analysis of electrical, optical, and mechanical failures from customer returns, out-of-spec parts from CM partners, as well as internal STRIFE testing failures, to strategically identify failure mechanisms and device weak points, and consequently prioritize the corresponding implementation of containment, corrective, and preventative actions to significantly reduce infant mortality rate in packaged devices by >10X;

• Designed and implemented modifications to production equipment to reduce precious metal consumption by >50%;• Quadrupled flip-chip SAC solderability by developing electroplated thick Ni/Au contact pad with low stress;• Developed new metal stacks for optimal ohmic contacts to both n-AlGaN and p-GaN, with superior contact quality and process stability, which resulted in a ~50% reduction in median device operating voltage by ~50%, improving wall-plug efficiency (WPE) and wear-out failure rates;• Improved equipment and process stability through design of experiments (DOE), and implementation of rigorous statistical process control (SPC) monitoring;• Successfully transitioned from chip development to highly manufacturable (DFm) 3-inch sapphire wafer LED volume production, as well as die shrinks reducing chip size by 75% while maintaining equal, or better, electrical and optical performance and lifetime. Together the yield improvements and die shrinks increased the average sellable chips per wafer by >6X;• For next generation LED chip design, developed UVC-transparent dielectric material, and UVC-reflective mirrors to maximize light extraction efficiency (LEE), quadrupling peak external quantum efficiency (EQE) of packaged devices;

• Managed up to 6 operators daily, directing workflows through front and back end of the wafer fab, coordinating with equipment engineering group on both repairs and routine maintenance, setting priorities to meet production targets, as well as helping the engineering team to achieve R&D goals;• Ensured strict adherence to all Federal, State, and RayVio environmental and safety regulations, and implemented corrective/preventative actions;• Increased annual chip production volume by >40X, and revenue by >7X, without adding new equipment or personnel;• Implemented workflows improvements throughout the wafer fab to reduce final visual yield loss by >60%, and increased wafer throughput by ~50%;• Coordinated with sales and marketing teams, as well as LED packaging CM partners to establish production schedules based on product requirements, market demands and raw material supplies, to ensure timely delivery of high-quality products;• Weekly report and update of production status, planning, and quality issues to management and engineering teams;• Drafted work instruction and SOPs for various processes-of-record and equipment, and trained operators and technicians to perform production and R&D tasks;

• Developed self-assembling techniques for large area uniform diatom (purified from live microalgae or diatomaceous earth) frustule monolayers, with nano-scale features, for dye synthesized solar cell and surface enhanced Raman spectroscopy applications.• Developed mercury vapor sensing devices based on amalgam-forming gold electrode with high sensitivity and portability.

• Characterized the mechanical properties of silicon oxy-nitride and silicon oxy-carbide thin films using nanoindentation.• Developed deposition techniques of various iron oxide thin films using DC/RF reactive sputtering;• Characterized various material properties of the iron oxide thin films using SQUID, SEM, XRD and EDX;• Designed, fabricated, and tested micro/nano iron oxide particle arrays with different structural configurations for multispectral and functional contrast agents used in magnetic resonance imaging;• Synthesized monodispersed tantalum oxide and gold nanoparticles, and developed patterning techniques forPEG-DA hydrogel particles for use in multispectral and functional computed tomography contrast agents.• Developed a simple 3-step anodization process for aluminum thin films directly grown on substrates with superior adhesion and uniformity. Achieved wafer-level uniform nanoporous AAO membrane with controllable pore size and spacing, ranging from ~90nm to 220nm;• Developed a nanomanufacturing platform based on template-assisted nanoimprint lithography using AAO membranes for cost effective and high throughput fabrication of size and shape specific polymeric nanoparticles.

• Mentored four teams of senior undergraduate students with their final design projects in four consecutive academic years respectively;• Proposed the research topics of these projects and helped the students to understand them, and to get started with conducting their own research with literature search and planning specific aims of each project;• Guided the students through their experimental design, and trained them on all the necessary equipment/procedures,, and helped the students with the research proposal and final report writing, as well as preparing for the final presentation.

• Teaching assistant for course ME 310 Instrumentation and Theory of Experiments, responsible for preparing and guiding junior/senior undergraduate students through different lab sessions, giving short lectures and grading lab reports on electrical, mechanical, fluidic and thermal dynamics experiments.

• Designed and fabricated a silicon based micro-needle array for biological fluid extraction and in situ analysis, optimized the DRIE process parameters for high aspect-ratio anisotropic silicon etching;• Investigated and developed an improved structural releasing method for silicon dioxide sacrificial layers in MEMS devices using buffered oxide etchant and glycerin additive.