Developed: 1. Unique high-efficiency apparatus for powder plating (both electroless and electro plating(partly applied) ;2. Nano-size silver plating process for face mask clothes, and related production line(cancelled due to mask fever ceased and the COVID-19 weakened); 3. Precise 3D printing method by electroplating techniques(theoretically design);4. Automatic production line for ultra-fine EDM(Electrical Discharge Machining) wire, stopped due to lack of selling ability;5. Automatic production line for looped diamond cable/wire saw, starting mass production;6. Nano-silver coated medical dressing material lab trail succeeded, suspended design production line due to limitation of hospital resources;7. Developed super-tensile tungsten wire via cold-drawn technique(tensile strength >6000MPa), it's the 1st time to obtain such material in the world.Designed and set up special plating line and cold-drawn machine;8. Thus made super tensile straight / loop diamond wires(cold-drawn tungsten) . hence much more possibilities;9. Mobius looped diamond belt saw, recipes for Diamond wire plating additives, Black silicon additives, and some more...Developing:1. Much progress on cold drawing of tungsten fine wire(used as core of diamond wires), which was suposed to be impossible in the industry;2. Next generation diamond wire mass production line;3. Concept designing of new process to directly electroplating Cu w/wo Sn electrodes on silicon wafer, it would dramatically reduce the cost of solar cells, happenly it's a combination of above expertises

Developed fixed abrasive sawing wire, or specified as diamond wire, which is a key product for new generation processing in PV, LED and magnets industries. By leading a small team, the process and equipment were developed independently from nothing at a very low cost in a short period.

Some of the projects related to electroplating, mainly focused on: cyanide-free brass plating, Cu-Co-Zn ternary plating, electrochemical leaching for fibers, pre-treatment improvement for ISC line

Trouble-shooting for plating line (Gold-cobalt, 2N gold, bright nickel ,rhodium), valid rate increased to 75+%, set up bath analyzing and controlling ability, completed internal quality control system.

Implemented the research and development of the plating process and chemical evaluation / product transfer / trouble-shooting. Concurrently supervised the manufacturing department to be responsible for the process cost down / quality and efficiency improvement / work force enhancement since June 2002 Developed the precise plating process for CPU socket connecter Set up BM(I) chemical standard specification of chemical material for NWIng Foxconn Programmed an analytic and querying software (Client /Server mode) for the lab Improved the product's deposit thickness Cpk from 0.8+ up to 1.2+; yield rate of final product from 96% to 98.2%, and increased the production capacity 20% after continuous improvement Planned and set up the Au-plating line for IHS(Pentium 4 CPU lid)

Non-routine jobs: Set up the analytic system for strontium(RAW / in-process / product analyzing), in which involved the method of volumetric /gravimetric /AA /Spectroscopic analysis Conducted the selective fluoric ion electrode method in cryolite analyzing and coded relative analytical program Set up a polyurethane paint product line in Weihai city, ShandongRoutine jobs: Daily analysis for the manufacturing of Al / Al-Mg alloy / Ca /Sr metals