Ya Wu Email and Phone Number

TF/P & C4 Process Engineer1. Utilizing semiconductor processing control system, e.g. SPC, PCSA, EP and E-TEST to conduct tests and measurements of production to determine control of process equipment over variables as temperature, density, pressure and viscosity.2. Establish and submit process requirements to be met in designing. Timely identify root cause of excursion with effective FA and utilizing Model Base Problem Solving methods. Team work with supporting module to solve production related issues.3. Transferring process technology into F68 as well as production NPI, leading and owning process and equipment qualification, tool preventative maintenance, management of troubleshooting activities, regular monitoring of tool performance, defect analysis and cost reduction to achieve both operation and equipment excellence under LEAN principle.4. Leading the equipment team to sustain BEST IN CLASS and WIP ramping.Working closely with cross module process engineers, yield, integration and manufacturing teams to ramp the 1st Intel 300 mm Fab in Asia.5. Develop solutions to problems for customers utilizing formal education and judgment demonstrating the Intel value of Customer Orientation.6. Working with existing Intel 300mm FABs around the world to improve tool and process performance, reduce cost, increase flexibility in process transfer and meeting with ISO9001/ISO14001/OHSAS18001 requirements.7. Leading the equipment team by promote an open and direct culture. Developing inventive solutions to improve execution and efficiency in a high-volume manufacturing environment.8. Great people management skills. Recognizing the right behavir and coaching the inappropriate by emphasize in discipline. Deliver the process and equipment training to equipment team and care for their work life balance. Coordinate with training department for their training schedule and oversee training arrangement.

Wet etch process engineer1. Transferring process technology into high volume manufacturing. Process developing and optimizing. SOP review and standardization.2. Management of new equipment installation and qualification. Second source and local source qualification for parts, repair loop and new chemical.3. Leadership or involve in other teams on task force or specific projects related with excursion trouble shooting, cost reduction and productivity improvement.4. Wet etch, and wet cleaning process control and optimization. APM，SPM，DHF，Stripping. DHF/BOE process, Al wet etch, silicon nitride strip, silicon strip，silicon wet etch, etc.5. Aluminum metal etch process control, process and recipe development as well. Familiar with DNS/P5000/DPS/LAM, etc.6. Back grinding and backside etching process control and optimization; Ti-Ni-Ag back metal peeling improve and the aging testing, new chemical testing. Familiar with the SEZ, SSEC equipment.7. Liaise with customers on meeting equipment/ process requirements & expectations. Good team cooperation, make new products and process converting smoothly.