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Yip Seng (Ys) Low Email & Phone Number

FCBGA BU Director at Amkor Technology, Inc.
Location: Tempe, Arizona, United States 9 work roles 2 schools
1 work email found @amkor.com LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email y****@amkor.com
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Current company
Role
FCBGA BU Director
Location
Tempe, Arizona, United States
Company size

Who is Yip Seng (Ys) Low? Overview

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Quick answer

Yip Seng (Ys) Low is listed as FCBGA BU Director at Amkor Technology, Inc., a with 7885 employees, based in Tempe, Arizona, United States. AeroLeads shows a work email signal at amkor.com and a matched LinkedIn profile for Yip Seng (Ys) Low.

Yip Seng (Ys) Low previously worked as Senior Manager at Amd and Engineering Manager at Amd. Yip Seng (Ys) Low holds Master Of Science (M.Sc.), Mechanical Engineering from Iowa State University.

Company email context

Email format at Amkor Technology, Inc.

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ylow@amkor.com
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AeroLeads found 1 current-domain work email signal for Yip Seng (Ys) Low. Compare company email patterns before reaching out.

Profile bio

About Yip Seng (Ys) Low

Managing semiconductor packaging development and outsourced manufacturing for the company. Expereienced in 2.5D package development and reliability qualification, flip chip assembly, material selection, design of experiment and qualification of semiconductor devices.Specialties: Advanced flip chip package development. Package Reliability and Qualification. Assembly development.

Listed skills include Semiconductor Packaging, Flip Chip, Design Of Experiments, Semiconductors, and 18 others.

Current workplace

Yip Seng (Ys) Low's current company

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Amkor Technology, Inc.
Amkor Technology, Inc.
FCBGA BU Director
Tempe, AZ, US
Website
Employees
7885
AeroLeads page
9 roles

Yip Seng (Ys) Low work experience

A career timeline built from the work history available for this profile.

Senior Manager

Amd

Santa Clara, California, Us

Leading engineering teams in Markham, Austin and Singapore developing processes and materials for new flip chip packages, defining and executing Chip-Package Interaction (CPI) qualification and managing off shore OSATs for product qualification and continuous process improvements.

Engineering Manager

Amd

Santa Clara, California, Us

Leading engineering teams in Markham, Austin and Singapore developing processes and materials for new flip chip packages, defining and executing Chip-Package Interaction (CPI) qualification and managing off shore OSATs for product qualification and continuous process improvements.

Flip Chip Director

Us

Led an engineering team for developing assembly process and material set for new flip chip packages, defined and planned for the customer programs, led continuous yield improvement and cost reduction activities, managed quality issue resolution and engineering resources.

Mar 2003 - Sep 2006

Senior Process Engineer

Santa Clara, Ca, Us

Managed the NPIs, quality, yield improvement and cost reduction activities for flip chip packages with assembly partners.

May 2000 - Mar 2003

R&D Engineer

Geneva, Switzerland, Ch

Developed interconnect processes for new packages and to study the new packaging technologies for STM.

May 1999 - Apr 2000

Process Engineer

Austin, Texas, Us

- Yield improvement for wafer dicing process.- Assembly setup and optimization for new products in the area of die attach and wire bond.- Brainstormed and conducted DOEs to understand assembly issue in the the area of wafer dicing, die attach and wire bonding.- Evaluated plasma clean for wire bonding to enhance adhesion on PBGA

Dec 1997 - May 1999
Team & coworkers

Colleagues at Amkor Technology, Inc.

Other employees you can reach at amkor.com. View company contacts for 7885 employees →

2 education records

Yip Seng (Ys) Low education

Master Of Science (M.Sc.), Mechanical Engineering

Iowa State University

Bachelor Of Science (M.Sc.), Mechanical Engineering

Iowa State University
FAQ

Frequently asked questions about Yip Seng (Ys) Low

Quick answers generated from the profile data available on this page.

What company does Yip Seng (Ys) Low work for?

Yip Seng (Ys) Low works for Amkor Technology, Inc..

What is Yip Seng (Ys) Low's role at Amkor Technology, Inc.?

Yip Seng (Ys) Low is listed as FCBGA BU Director at Amkor Technology, Inc..

What is Yip Seng (Ys) Low's email address?

AeroLeads has found 1 work email signal at @amkor.com for Yip Seng (Ys) Low at Amkor Technology, Inc..

Where is Yip Seng (Ys) Low based?

Yip Seng (Ys) Low is based in Tempe, Arizona, United States while working with Amkor Technology, Inc..

What companies has Yip Seng (Ys) Low worked for?

Yip Seng (Ys) Low has worked for Amkor Technology, Inc., Amd, Asat, Agilent Technologies, and Stmicroelectronics.

Who are Yip Seng (Ys) Low's colleagues at Amkor Technology, Inc.?

Yip Seng (Ys) Low's colleagues at Amkor Technology, Inc. include Maryjane Latayan, Doohee Park, Helen Chang, Nyle Saints, and Mandy Chung.

How can I contact Yip Seng (Ys) Low?

You can use AeroLeads to view verified contact signals for Yip Seng (Ys) Low at Amkor Technology, Inc., including work email, phone, and LinkedIn data when available.

What schools did Yip Seng (Ys) Low attend?

Yip Seng (Ys) Low holds Master Of Science (M.Sc.), Mechanical Engineering from Iowa State University.

What skills is Yip Seng (Ys) Low known for?

Yip Seng (Ys) Low is listed with skills including Semiconductor Packaging, Flip Chip, Design Of Experiments, Semiconductors, Engineering Management, Packaging Engineering, Manufacturing, and Semiconductor Industry.

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