Yk Chee Email & Phone Number

Ipoh, Perak, Malaysia

Responsible as a PJM role for OSAT package development

Ipoh

Responsibilities :- Support pilot manufacturing line in the area of assembly, testing and evaluation of new products.- Collaborate with R&D team and participate in the design, qualification, implementation of new test processes and product transfer.- Develop and maintain a systematic debug guide and documentations for responsible products.- Drive efforts in re-engineering, cost reduction, yield improvement, quality and reliability improvement.- Support and initiate ECOs, BOM changes, test processes, procedures and specification modifications.- Evaluate yield, cost, performance, and suitability for release into production.

Perak, Malaysia

Main Responsibilities(Brief description) :-Responsible and taking care on the FOL process Flip Chip die attach and Reflow furnace. Support on Die attach, screen print, solder dispense, flux cleaning & underfill if needed.-Responsible to resolving problem and issue occurred in the package development line.-Responsible for performing analysis study on all the defect units.-Perform DOE, process characterization for new package and qualifying new materials.