Determined and implemented the company vision, and developed roadmaps accordingly, to grow revenues for the existing “ViSi Mobile” device that provides continuous monitoring of seven vital signs, including blood pressure for patients in general care settings. Developed objectives and contributed to the design of the next generation product for hospital use as well as for the growing home healthcare market.

Responsible for setting up engineering and operations in the US for all emerging Foxconn medical products. The responsibility included hiring the core operation team and developing strategies, business plans and processes.

Responsible for the Technology & Operations of a radiosurgery medical device. Built the engineering and manufacturing teams that consist of 40 engineers and led Technology from development to production of that revolutionary high precision medical radiosurgery device started at Varian. Built the team to set up the pilot manufacturing in San Carlos and transitioned the production to China. The medical device was FDA approved in September 2017 and the first patient was treated in January 2019 at Barrow Brain and Spine, a partner of Barrow Neurological Institute in Phoenix, Arizona.

Individual contributor primarily responsible for the development and design of a novel radiosurgery device using low energy linear accelerator to treat specifically tumors in the brain. Project evolved later in founding of Zap Surgical Systems, Inc.

Responsible for the Equipment Technology & Operations of Solyndra Solar Panel Manufacturing Factory• Consolidated and re-organized the Front End and Back End Engineering groups that consisted of 150 engineers responsible for developing, specifying, and designing $300M of capital equipment for the state-of-the-art solar panel manufacturing factory.• Responsible for equipment operations teams (build and install) consisting of 80 engineers and technicians to complete Solyndra’s factory.• Developed the infrastructure to manage all equipment technology designs, operation projects, resources, and related budgets.• Built, organized, managed and led a group of 70 engineers to develop solar manufacturing equipment, including Scribe, Wet Deposition tools, all Back End Packaging systems and the corresponding automation and related Software/Controls.• Led development of the equipment design to continuously improve the process for enhancing device performance and solar energy efficiency.• Led design improvements to enhance equipment yield, availability, and throughput performance.

Led the development, design and release of the high throughput Gamma Express photoresist removal production equipment.• Led company cross-functional program to develop and release a new low cost photo resist strip tool for low cost, high reliability (above 95% tool availability), and high throughput. First tool shipped to customer in May 2006.• Program responsibilities include managing prototype engineering development, product design, prototype manufacturing, material management, and interacting with customer to define tool specifications.• Led the engineering group to design the new low cost photo resist strip tool.• Managed the engineering group to develop a coordinated motion type wafer handling for high throughput. Developed a new high strip rate Inductive Coupling Plasma source.• Led the 300mm SIG engineering group to resolve all reliability issues for the 100 tools install based. All new designs implemented on production tools since September 2005.• CMP task force leader to compete at customer site against the CMP market leader. Improved tool reliability and process results on wafer.

Led the polisher mechanical group with 9 direct reports, to develop and release the new 300mm LK Reflexion polisher and Post-CMP DESICA systems. • Developed and designed key CMP polisher process modules including (Platen, Pad Conditioner, Slurry Arm, Cleanliness and Copper recovery modules). • Led the mechanical post-CMP cleaner group with 4 direct reports, to integrate and release a 300mm key/differentiator process dryer module and a random access wafer transfer system on DESICA. • Led a team of 5 mechanical engineers to develop a new intelligent pad conditioner, a direct drive platen assembly and a low consumption slurry-dispensing module. • Developed and designed the new generation of a single wafer dryer module for Post-CMP integrated system. Designed and demonstrated its reliability. This new 300mm module is integrated on DESICA system product. • Developed and designed a new random access wafers transfer system of a post-CMP cleaning integrated system. Designed and demonstrated its reliability. This new 300mm module is integrated on DESICA system product. • Designed and released Liquid Delivery Modules for post CMP 200mm Mesa and 300mm Reflexion systems. Increased the value engineering by improving the performance and materials, as well as implementing a 25% cost reduction.