Yu Hwan Kim Email and Phone Number

Team leader who has the role of LMFC (liquid mass flow controller) in semiconductor & display industry

Semiconductor Part & Module1. Piezo-actuated Chemical Dispensing Nozzle and Supply System Used in Cleaning Equipment for Removing Contamination Particles on the Semiconductor Wafer, 2018.05 ~2. Low Weight Wafer Spin Chuck Using Additive Manufacturing of Single Wafer Etching and Cleaning Equipment, 2019.01 ~3. LED Chuck for Increasing Temperature of Semiconductor Wafer in PR (Photo Resist) Strip and SiN Etching Process4. Twin Fluid Nozzle for Physical Cleaning of Semiconductor Wafer with Narrow Droplet DistributionAdditive Manufacturing Product1. Additive Manufactured Heat Exchanger (AlMg10Si, Ti64) used in Automobile, 2018.08 ~2. Additive Manufactured Chassis & Power Train Parts (AlMg10Si, Selective Laser Melting) in Automobiles, 2018.09 ~3. Additive Manufactured Link Structure Part and Wing Tip Cap (Ti64, Selective Laser Melting) of A320XWB (AirBus) Cargo Door, 2017.12 ~4. Additive Manufactured Cooling Plate of LED Chuck in Semiconductor Equipment (AlMg10Si, Selective Laser Melting, 2017.08~Government Funding R&D Project1. Development of Metal 3D Printing Commercialization Technology for Demands Localization of Power Plants, 2018.07.01 ~ 2020.12 31.2. Development of High Efficient F-class Gas Turbine Hot Component by Controlling and Applying DfAM, 2019.05.01 ~ 2024.04.30.3. Development of Additive Manufacturing Technology for the Lightweight (over 25%) High Strength (920MPa Ti 330MPa Al) Structural Components of Civil Aircraft Door and Wingtip, 2019.04.01 ~ 2021.12.31.4. Development for Car Body Lightweighting and Material Localization Using 3D Printing Technology, 2019.04.01 ~ 2021.12.31

Semiconductor Cleaning Equipment Design1. Micro droplet nozzle development for the removal of the contamination particle on semiconductor wafer in sub-20nm node devices collabrating with SAMSUNG electronics2. Development of special chuck system of heating wafer backside for stripping SiN thin film by phosphoric acid and the reducing chemical (sulfuric acid) quantity consumed collabrating with SAMSUNG electronics3. Process development of IPA drying solution by humidity control in semiconductor cleaning

Semiconductor Packages SimulationSolder Joint ReliabilityWire Bonding SimulationTSV Interconnect Simultion