ATE Wafer Sort Hardware Infrastructure as Equipment Lead. Main responsibilities are : •Manage sort hardware bring-up activities (coordinate design work, ensure on-time hardware delivery, phase-gate deliverables, and hardware qualification.)•Lead and drive hardware troubleshooting activities.•Establish hardware qualification criteria and key production parameters to achieve quality and manufacturing targets.•OSAT/supplier management: review deviation reports and drive process improvements.•Quality advocate in new hardware implementation or modification processes.•Perform statistical analyses using JMP for evaluation, optimization, and troubleshooting.•Technical presentations and maintain comprehensive documentation.Key Contributions & Achievements:•Drive the implementation of real-time test parametric monitoring at OSAT, enhancing early detection capabilities and reducing excursion cases.•Achieved a 3% yield improvement by introducing a multi-sensor chuck solution.•Boosted Units Per Hour (UPH) by up to 10% through optimization of controller and PID, reducing index time on multi-sensor chuck systems.•Maintained a perfect 100% On-Time Delivery (OTD) and First-Time-Right (FTR) performance for sort hardware.•Secured 2nd place at the AMD Asia Technical Conference 2024.

Role as R&D Display TFT Manufacturing engineer, responsible for lot scheduling, resource allocation, coordinate machine preventive maintenance activities for TFT display manufacturing equipment(dry/wet etch, photolithography, PVD/CVD, oven, etc..)

Role as HVM Assembly Equipment Engineer, owner of Disco Laser Groove(DFL-7161) and Lintec Tape laminator(RAD-3810). Main Responsibilities are:•Troubleshoot and solve complex issues escalated by technicians.•New equipment set up and qualification.•Continuous OEE and MTBA improvement.•SME for FDC, SPC, FMEA.•Conduct MSA to ensure equipment quality and performance.•Auditee for internal and external audit.Contributions/Achievements :•Rated with exceed expectation for FY2021 and was promoted to E2 on Jan’22.•Improved yield by 2% on Lintec Tape Laminator (RAD-3810) by eliminating peeling failures.•Boosted UPH by 6.5% on Disco Laser Groove (DFL-7161) through configuration parameter optimization.•Enhanced utilization by 1.6% on Disco Laser Groove (DFL-7161) by automating the manual record-keeping process during preventive maintenance.•Increased yield by up to 3% on Disco Laser Groove (DFL-7161) by resolving wafer cracking issues via optimized chuck cleaning parameters.•Improved MTBA by 1.6 hours on Disco Laser Groove (DFL-7161) by minimizing major alarm occurrences.•Achieved 0 NCs and OFIs as an auditee during the IATF 16949 Certification Audit and BOSCH customer audit in 2022, covering the Maintain Equipment section.

Responsibilities :•Teach students how to use Advanced Aircraft Analysis software.•Prepare course material.

Responsibilities :•Teach students how to use SOLIDWORKS 2018.•Prepare course material.•Prepare mid term and final exam questions.•Mark students written and practical homework and exam.