Managing rugged mobile phone development project with team crossing US, India and China as global project manager. Succesfully launched in-stock projects for AT&T, Verizon and Sprint in USA.Familiar with the mobile phone development (ME/HW/SW), type approval, production/testing and the TOP3 US telecommunication carriers' certification process for both generic and intrinsically safety product.Main projects completed in Sonim:XP1301 NFC/XPand LS: Work with ODM partner Nollec… Show more Managing rugged mobile phone development project with team crossing US, India and China as global project manager. Succesfully launched in-stock projects for AT&T, Verizon and Sprint in USA.Familiar with the mobile phone development (ME/HW/SW), type approval, production/testing and the TOP3 US telecommunication carriers' certification process for both generic and intrinsically safety product.Main projects completed in Sonim:XP1301 NFC/XPand LS: Work with ODM partner Nollec to design the extended battery cover with NFC/loud speaker for existed product XP1300 and XP3300.XP5560 IS: Intrinsically safe version of Sonim XP5560 device. Work with ODM partner Nollec and IS design partner ecom to provide IS version to European market, AT&T in US and Bell in Canada.XP3405: Facelift version of Sonim XP3400, totally new ID/mechanical design worked with ODM BYD, target market is ACG and Sprint in US.XP4400: First clamshell handset in Sonim targeting ACG in US, ODM was BYD.XP6/XP7: First smartphone project in Sonim, specifically focus on proto build and NPI area. Established the first AT&T FAI process in Sonim SZ factory. Setup the XP6 FAI testing process in Genco Dallas.XP7/XP5 VZW: First Verizon project in Sonim, coordinate with US team to establish the Verizon ODI product certification process. XP5 VZW turned into an in-stock project for Verizon, work with team and ODM Borqs to re-evaluate in-stock SoC and switched to in-stock certification process, finally received the first Verizon technical acceptance.XPi: First IOT project in Sonim, Co-designed with Intel/Firmwave Ireland. Successfully passed AT&T IOT device certification.XP3: First inhouse designed clamshell handset, successfully got technical acceptance from Sprint in 13 months and from AT&T in 14 months. Following variants received TA from Verizon, USCC, ACG, Bell, Telus, Rogers. Show less

Responsible for the program management from NPI, mass production to EOL phase, including new products price quoting, investment budget and follow up, DFM, trial production. Also in charge of quality, productivity, cost of the product. More over, excess material control and productivity arrangement at EOL phase.Report to: PLMUnderlying: 2Project experience: SonyEricsson K800 serials, G700、G900、C702 mobile phone product, RFMD substrate production. Had being sent to Sweden several… Show more Responsible for the program management from NPI, mass production to EOL phase, including new products price quoting, investment budget and follow up, DFM, trial production. Also in charge of quality, productivity, cost of the product. More over, excess material control and productivity arrangement at EOL phase.Report to: PLMUnderlying: 2Project experience: SonyEricsson K800 serials, G700、G900、C702 mobile phone product, RFMD substrate production. Had being sent to Sweden several times in the purpose of new products introduction.Achievement: From the second half of 2006 to the beginning of 2007, lead the team doing K800 project quality improving work. Successfully, get the company top out of the customer satisfaction competition from the last one and keep the top for consecutive 9 quarters. Show less

Responsible for the new products introduction, process setup, production document, process and quality improvement. Went to France for Wavecom product transfer. Familiar with SMT production, repairing and testing process for personal communication product.Report to: PMProject: Wavecom Q2、P5 serials, SonyEricsson K500、W550 phones