Zhiping An
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Zhiping An Email & Phone Number

VP of IC product management; ISO26262 FuSa Manager at Beijing Mlink Technology Inc.
Location: Beijing, China, China 4 work roles 2 schools
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Current company
Beijing Mlink Technology Inc.
Role
VP of IC product management; ISO26262 FuSa Manager
Location
Beijing, China, China

Who is Zhiping An? Overview

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Quick answer

Zhiping An is listed as VP of IC product management; ISO26262 FuSa Manager at Beijing Mlink Technology Inc., based in Beijing, China, China. AeroLeads shows a matched LinkedIn profile for Zhiping An.

Zhiping An previously worked as VP of IC product management; ISO26262 FuSa Manager. at Beijing Mlink Technology Inc. and IC design manager at Lenovo. Zhiping An holds Bachelor'S Degree, Ee from Zhejiang University.

Profile bio

About Zhiping An

Zhiping An is a VP of IC product management; ISO26262 FuSa Manager at Beijing Mlink Technology Inc.. They possess expertise in ic design, ic project manangement, chip integration, ssd controller, low power design and 15 more skills. They is proficient in 英语.

Listed skills include Ic Design, Ic Project Manangement, Chip Integration, Ssd Controller, and 16 others.

Current workplace

Zhiping An's current company

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Beijing Mlink Technology Inc.
Beijing Mlink Technology Inc.
VP of IC product management; ISO26262 FuSa Manager
4 roles

Zhiping An work experience

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Vp Of Ic Product Management; Iso26262 Fusa Manager.

Current
Beijing Mlink Technology Inc.

Beijing City, China

Established in 2013, MLINK is a high-tech company specializing in the research and development of advanced integrated circuit chips. The company currently has two main chip business lines: cellular IoT chips (NB-IoT, LTE Cat1bis, and 5G NR Redcap, among others) and automotive LiDAR chips for the AV/ADAS market.In the communications chip sector, MLINK's.

May 2017 - Present

Ic Design Manager

Current
Lenovo

Beijing City, China

Lead the team to accomplish architecture and RTL design of 16nm/28nm consumer and enterprise-level SSD controllers.Responsibility:- SSD front-end datapath design and implementation.- PCIe/NVMe/DDR IP integration and debug- Sub-system architecture and RTL integration.- Complex hardware accelerator IP architect- Project management- Team management

Apr 2013 - Present

Ic Project Manager

Beij Innofidei Technology Inc

Beijing City, China

Lead the team to have more than 10 times successful tape-outs in CMMB/LTE/Application-processor industries.Responsibility:- Project management- Complex IP micro-architecture define and RTL implementation.- SoC subsystem architect- ARM cortex-M/R/A series CPU integration and debug- AMBA multi-layer bus matrix define and integration- Synthesis/Formal.

May 2009 - Mar 2013

Ic Design Engineer

Datang Micro-Electronics Technology Inc

Beijing City, China

Participate in 32-bit MIPS core design and large density smart-card projects based on the MIPS core.

Apr 2006 - Sep 2008
2 education records

Zhiping An education

Master'S Degree, Ee

China Academy Of Telecommunication Technology (Catt)
FAQ

Frequently asked questions about Zhiping An

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What company does Zhiping An work for?

Zhiping An works for Beijing Mlink Technology Inc..

What is Zhiping An's role at Beijing Mlink Technology Inc.?

Zhiping An is listed as VP of IC product management; ISO26262 FuSa Manager at Beijing Mlink Technology Inc..

Where is Zhiping An based?

Zhiping An is based in Beijing, China, China while working with Beijing Mlink Technology Inc..

What companies has Zhiping An worked for?

Zhiping An has worked for Beijing Mlink Technology Inc., Lenovo, Beij Innofidei Technology Inc, and Datang Micro-Electronics Technology Inc.

How can I contact Zhiping An?

You can use AeroLeads to view verified contact signals for Zhiping An at Beijing Mlink Technology Inc., including work email, phone, and LinkedIn data when available.

What schools did Zhiping An attend?

Zhiping An holds Bachelor'S Degree, Ee from Zhejiang University.

What skills is Zhiping An known for?

Zhiping An is listed with skills including Ic Design, Ic Project Manangement, Chip Integration, Ssd Controller, Low Power Design, Rtl Coding, Image Processing, and Sim Card Ic.

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