several years experience in semiconductor product development, NPI and production. Skilled on RFIC IC design from concept to delivery; 3. Strong problem solving and Electronics ability as well as process control capability. Good interpersonal communication skills as well as ability to work independently or in a team
Nantong Fujitsu Microelectronics Co. Ltd.
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Director Of Wafer Level Package Dept.Nantong Fujitsu Microelectronics Co. Ltd. Oct 2011 - PresentNantong, Jiangsu, ChinaIt's Wanchun for Bumping, WLP process.
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部门经理中芯国际 Oct 2004 - Oct 2011历任 Bump 工艺整合, Bump 工艺经理, Bump Metal 经理, Bump 质量部经理, TD 经理 (TSV backend 工艺) -
高级工艺工程师Lam Research May 2002 - Oct 2004
Frequently Asked Questions about 丁万春
What company does 丁万春 work for?
丁万春 works for Nantong Fujitsu Microelectronics Co. Ltd.
What is 丁万春's role at the current company?
丁万春's current role is Director of Wafer Level Package Dept. at Nantong Fujitsu Microelectronics Co. Ltd..
What schools did 丁万春 attend?
丁万春 attended 浙江大学.
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