金世强's Location
Shanghai, China, China
About 金世强
金世强 is a Smiths Medical - Senior Software Engineer.
金世强's Current Company Details
Smiths Medical - Senior Software Engineer
金世强 Work Experience Details
-
Senior Software EngineeringPulnovo Medical Nov 2021 - Nov 2023中国 上海市 -
Senior Software EngineeringSuzhou Hengrui Medical Devices Co., Ltd. Nov 2019 - Mar 2021中国 上海市 -
Senior Software EngineerSmiths Medical Oct 2018 - Apr 2019中国 上海 -
Engineer SoftwareSmiths Medical Oct 2016 - Oct 2018ShanghaiFirmware sustain of legacy syringe pumps.Firmware implementaion of Graseby C9 syringe pump.Desgin and implement the firmware (architectue and modules) of next generation large volume pump.
-
Engineer SoftwareShanghai Huahong Integrated Circuits Co.,Ltd. Jan 2015 - Sep 2016Shanghai,ChinaFirmware and hardware driver development and maintenance in COS -
R&D EngineerLds Intelligence Technology(Shanghai) Co.,Ltd Sep 2011 - Sep 2014Smart home products development include:HW design and implementatonProduct software implementationSoftware test Design Transfer
金世强 Education Details
-
Electrical, Electronics And Communications Engineering
Frequently Asked Questions about 金世强
What is 金世强's role at the current company?
金世强's current role is Smiths Medical - Senior Software Engineer.
What schools did 金世强 attend?
金世强 attended Shanghai University.
Not the 金世强 you were looking for?
Free Chrome Extension
Find emails, phones & company data instantly
Find verified emails from LinkedIn profiles
Get direct phone numbers & mobile contacts
Access company data & employee information
Works directly on LinkedIn - no copy/paste needed
Aero Online
Your AI prospecting assistant
Select data to include:
Total price:
$0.00
0 records × $0.02 per record
Download 750 million emails and 100 million phone numbers
Access emails and phone numbers of over 750 million business users. Instantly download verified profiles using 20+ filters, including location, job title, company, function, and industry.
Start your free trial