Wilson Zhu Email and Phone Number

Responsibility:1.Intelligent manufacture business group set up; 2.Define business model and product roadmap;3.Operation process and system set up;4.Business development, negotiation, major customer management; 5.Supply chain development, management and optimization.Achievements:1.Build up Smart factory technical team with internal and external resource like Automation equipment team, MES team and Intelligent warehousing team, define core value based on previous experience and key competence;2.Define business model and focusing area align with corporation business resource, develop 3C, Clothing industry and automobile industry show case on MES product, build up 1st PC/Server intelligent factory with whole automated assembly line and MES system, also successfully implement the 1st intelligent warehousing project in electronic assembly industry.3.Establish customer management, business management, pre-sale follow-up, BOM cost analysis, quotation management and project management process, quarterly optimize objective and strategy upon actual operation status, ensure team growing with profitability;4.Define business objective, motivation system and business strategy for different products, lead on major customer development, business communication and negotiation, achieve overall 58millon RMB revenue in 1st year including 3 software projects(3C and Clothing industry), 4 automation assembly line projects(PC/SV, Charger and printer line) and 2 intelligent warehousing projects(electronic assembly industry). Keep 80million RMB revenue in recent 2 years.5.Intellgent factory supplier sourcing, establish supplier audit and qualification guideline, optimize supplier resource via project assessment to improve implement quality, increase supplier pricing and price negotiating practice to reduce project cost.

Responsibility:1.Chengdu Die-prep factory transfer;2.New product introduction and MP products process optimization;3.Chengdu Die-prep factory manufacture system and quality management system establishment;4.Key integrated issue solving.Achievements:1.Lead on Chengdu Die-prep factory transfer including product, quality, capacity, equipment, material, process and people skill transfer strategy, accomplish the biggest Die-prep factory transfer and achieve stable mass production with improved quality and yield goal in 6 months. 2.Define NPI strategy based on technology and process difference, set up process route, finalize statistical data collection plan according to key process parameters and quality goal, follow up with equipment, accessories, material, people training plan, finally introduced 22 new products in 3 different technologies;3.Establish new factory manufacture and quality management structure, including factory-level daily and weekly meeting, department-level weekly meeting for MFG, AE, Quality and IE department, co-work with stakeholders to define key indicator, track on delivery and WIP material, surface out manufacture issues based on KPI status and push on improvement plan. Introduce MES system and define data traceability strategy, set up automatic process control(APC) system to enable automated process optimization by statistical algorithm on key process parameters, also link with MES to timely screen out quality issue and contain affected material. 4.Lead on high risk die chipping task-force, take multiple actions like Saw machine parameters optimization, tape material change and downstream mounting equipment process update to reduce defect rate from 3000DPM to 1000DPM.

Responsibility: 1.Product yield and quality improvement;2.Manufacture management and system optimization;3.Key integrated issue solving.Achievements: 1.Set up ATM yield and quality management dashboard, define objective and roadmap, lead on factory-level daily and weekly meeting to monitor yield and quality performance, follow-up with short term and long term action plan. Develop visualized data analysis tool to pull raw assembly and test data from database and automatically generate visualized analysis result which can help operator quickly detect process issue without professional training. 2.Chair factory-level Ops meeting to monitor manufacture key indicators and push on continuous improvement action plan. Lead on DFM system implementation in Chengdu ATM factory, analyze commonality and correlation on process parameter to define alarm trigger rule and set up on-line PCS system for suspicious material containment. Optimize back-line vision system to enable automatic defect vision categorization, finally set up defect product contactless process with vision data timely uploading and engineer on-line response;3.Lead on Losscode and Defect detection system(LCAD) development, define software function requirement, business process, change control and implementation procedure, finally successfully implemented in Chengdu factory and proliferate to other oversea factories(U.S./Malaysia/Vietnam);4.Lead on die crack working group, detect whole line hard particle, identify and contain the particle source to reduce high level issue occurring frequency from 6times/year to 1time/year.

Responsibility: 1.HuaWei products’ testing system development and project management;2.Lead on the team with 22 people for software, mechanical and electronic development;3.Test data analysis, test system optimization to achieve lean manufacturing;4.New technology development.Achievements: 1.Set up 1st HuaWei phone and LAD cards’ testing system for 1000K/M’s capacity; 2.Optimize product line, reduce testing time, improve 15% production efficiency;3.Introduce Cell Production mode, save 20% production place and ~3million rmb/Year cost;4.Accomplish automatic Click and Micro motion control card’s patent application.

Responsibility: 1.Motorola products’ testing system development and project management;2.Lead on the team with 16 people to response for software, mechanical and electronic development;3.Electronical failures analysis, test data analysis and test system optimization; 4.Standard development procedure establishment.Achievements: 1.Introduce Motorola V8,V9,V9m Flip testing system, and ramp up for MP;2.Set up 1st phone assembly line in Brazil, accomplish equipment and material transfer, machine debugging, trial run verification and the first 50k delivery within 2 month, also establish related production, quality, engineering system for Brazil factory;3.Eliminate testing system gap between vendor and customer, 300K rmb/Year cost saving on rework caused by testing distinction.4.Standardize testing development process including requirement collection, DFM proposal, manufacture, debugging and validation, also proliferate to other divisions.