吴俊刚 Email & Phone Number

Responsibe for process optimization and improvement, including UV printing ,FFC/FPC bonding,coversheeet assembly,lamination,TSE filling ,shrinking,venting,ALT test,inspection and etc;-defects analysis and resolve for Accutouch screen;-write and optimize work instuctions for production;-NPI program,including new BOM build ,fixture and template prepared ,call for NPI meeting and DVT,PVT trail run report summarized; -New process introduced ,such as DT30 assembly and laser… Show more Responsibe for process optimization and improvement, including UV printing ,FFC/FPC bonding,coversheeet assembly,lamination,TSE filling ,shrinking,venting,ALT test,inspection and etc;-defects analysis and resolve for Accutouch screen;-write and optimize work instuctions for production;-NPI program,including new BOM build ,fixture and template prepared ,call for NPI meeting and DVT,PVT trail run report summarized; -New process introduced ,such as DT30 assembly and laser process;-Responsible for customer complaint;-ECO perform and new products RFQ.Manily Performance:-UV crack improvement,defect rate reduced from 5% to 0.7%; -DT30 QCO improvement,QCO shorten from 40 min to 15min; -ACF soldering improvement,defect rate reduced from 0.8% to 0; -ZB products touch shift improvement,defect rate reduced from 2.5% to 0.1%. Show less

provide technical support for production department.Mainly as follows:-slove the painting issue and help to improve the yield;-New painting fixture development; -provide technical support for supplier in outer painting; -the package design for new program and arrange sample making; -Wirte WI/SOP for NYPRO package and perfect packaging WI,reduce the cost.mainly customers: HTC,Plantronic,Novatel,Rainbird,Neventix,Option,B&N,Altek and etc.

responsible for process control and improvement; -defect analysis and quality improvement;-yield and uptime improvement ,Output and TPT;-write and perfect SOP.Manily Performance:-PQC Solder-ability LRR from 0.075% reduced to 0.0045%;-PQC Dark termination PPM from 2.1 reduced to 1.1; -Plating uptime from 94% Improved to 97% -yield Loss from 0.35 reduced to 0.1.