Semiconductor

In charge of 300mm Diffusion Equipments that include Furnace (TEL INDY PLUS, FORMULA ),Implant(AMAT HCP, MEHD2 ; AXCELIS Purion XE),Wet(SCREEN FC3100, SS3200 ; JET BW3000F,I ; Lam SP323, DV38, DV34),Epi (AMAT ACP-ATM EPI),RTA (AMAT Radiance Plus).Project:1, from day one for process tool, subsystem, supporting, IDM evaluation;2, from day one in charge of ML tool move in and installation and qualify;3, from day one support data for Facility build up.4, from day one do the budget forecast for tool setup and running.5, Parts evaluation and parts clean evaluation for cost management.

In charge of the 200mm wet clean mini-line equipments set up(evaluation, purchase, installation, tuning, qualify) @ DIFF/WET EE (WS820L,BW2000,SP223,SS-W80a/b-AR,Pegasus,Sugai) and ramp up to 32K; in charge of the operation of wet equipment section and achieve production requirement.In charge of the 300mm wet clean mini-line equipments set up(evaluation, purchase, installation, tuning, qualify) and production will expected at the of 2017 @ DIFF/WET EE (FC3100,SU3100,SS3100,BW3000i,DV38,Zeta300)

Responsible for cleaning equipments of 300mm @ ET/WET EE (DV Prime,DV38,SP4300,SP323,SP302,TEL CELLESTA/i,BW3000F/i,LAM C3) maintain and monitor its running state to reach production requirement, in charge of LAM single wafer cleaning; familiar with and understand ETCH equipments LAM 2300(kiyo, Flex, Versys) AMAT DPSII, eMAX and TEL SCCM, etc

Responsible for cleaning equipment of 200mm @ DIFF/WET EE (WS820L,WS820C,KAIJO,SP203,KLA-TENCOR,Rudolph) maintain and monitor its running state to achieve the production requirement. Familiar with and understand TEL 8s/8se furnaces.