Responsibility:1. In charge of designing the new 5015 Series (5015/97/AC) products and set up the related document in house such as BOM and so on.2. Co-work with PM guys to meet the customer’s request, such as provide test report, customer drawing, COC and so on.Achievement:1. Design two DTHD products to mate the 8# contact and 12# contact for heavy equipment special.2. Design one 4 ways DTP product for mate machining & stamping 12# contact use in heavy equipment special;3. Design one 97 series plug connector which contact arrangement is 20-29 for Panasonnic;4. Design one AC series plug connector which with one grounding contact and its’ arrangement is 18-10 for YASKAWA;

Responsibility:1. Arrange/Lead team members to do EVT/DVT DFM/DFA reports for Apple iPhone/iPod (EVT:engineering validation test), and co-work with Foxconn PD and Apple PD to make the improvements 2. Work out the root cause of the mechanical issue and provide the action plans/improvement suggestion both for production and ME control run 3. Lead the team to monitor PVT and ramp yield, and fix the abnormal issues on site to make sure MP line run smooth to meet the yield target and the UPH target4. Make the professional trainings for teamAchievement:1. Analysis the no SIM card issue of iPhone 3 alone,and its' yield rate is 100% after improvement; 2. Lead the team to analysis and improve the menu key poor feeling issue,and its' yield rate would be over 99% after improvement; 3. Lead the team to control BP gap/CG gap issue,and its' yield rate would be over 98% after improvement; 4. Lead the team to handle the motor spring deform issue,and its' yield upgrade from 70% to 99%; 5. Arrange/Lead the team finish over 20 DFM/DFA and push Apple to improve the design as those analysis;

Responsibility:1. As a coordinator, take charge of product transferring from TWN to mainland, be sure to CE (copy exactly) of the process form one site to another site2. Be responsible for product process setting up, debugging & trouble-shooting3. Leading the team to improve product process yield rate, so that the product can meet HVM (high volume manufacture) and market forecast4. Leading the team to solve customer complaint during HVM5. Take charge of cost down plan of products6. Develop and design new productAchievement:1. Completed designing LP754 and lead the team to improve its' process and quality 2. Leaded the team to improve the lead free type product of BGA754;3. Leaded the team to deal with the Intel complain of LGA771 TC test;4. Leaded the team to finish the status form DR4 to DR7 of LGA1207;

Responsibility:1. To be trained about the process management, improvement and the quality control 2. To be trained about the professional software such as pro-E/CADAchievement:1. Completed drawing more than 20 3D drawings base on their 2D drawing