1.Possess experience with and sound working knowledge of Power device Characteristics/Assembly/Testing process, Supplier management.2.Result-oriented characteristic, high-stress resistance plus be able to create, develop, refine, and implement power device package/testing-related processes and procedures. 3.Demonstrate planning leadership skills and attention to detail. 4.Keep working as a challenge seeker for opportunities in R&D and Product Engineer role to cultivate advanced engineering expertise.
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Senior Engineer Of R&D Process Integration EngineerUnikorn Semiconductor Jan 2023 - Oct 2024台灣 Taiwan 新竹市1. Customer technical service for GaN power device.2. Coordinate with factory and cross-functional team for process and quality issue solving.3. Establish and improve process condition and technology.
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Test Department ManagerUnikorn Semiconductor Nov 2021 - Dec 2022台灣 Taiwan 新竹市1. Manage Ⅲ-Ⅴcompound semiconductors testing.2. Developing strategic plans for the Test Engineering.3. Build up test capability from 200pcs/month to 5000pcs/month
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R&D Deputy ManagerOsten Epitaxy Electronics Corp. Jan 2021 - Oct 20211.Responsible for 100V/600V GaN HEMTs development.2.New products plan and progress tracking.
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Senior Product EngineerGv Semiconductor Jan 2019 - Dec 2020The role: Device characteristic, Backend operation1.Design and development of test pattern.2.Collaborate with a third party to execute the SiP test project.3.Evaluate several test platforms to satisfy GaN product characteristics.4.Manage and optimize supplier according to company need.
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Research And Development EngineerEpistar May 2016 - Dec 2018Focused on GaN Power device R&D1.Accomplished a reliability test system to increase work efficiency.2.Designed ten prototype package layout and target to 600V. 3.Executed the static/dynamic measurement to value device characteristics. -
Process Integration EngineerEpistar Aug 2014 - Apr 20161.Coordinated with internal department to improve product yield and drive quality performance improvement. 2.Collaborated with the R&D team to implement new processes and product transfer.3.Achieved process improvement by experiment design and data analysis. -
Optoelectronics Engineer工業技術研究院 Jul 2013 - Jun 20141.Built-up reliability test method/mode to reduce LED's aging time. 2.Analyzed electrical data and summarize the result.3.Assisted project manager to execute the experiment.
Frequently Asked Questions about 楊叔翰
What is 楊叔翰's role at the current company?
楊叔翰's current role is Osten Epitaxy Electronics Corp. R&D Deputy Manager.
What schools did 楊叔翰 attend?
楊叔翰 attended 國立彰化師範大學.
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