SMIC Turnkey business mass production management.In charge of jobs: traditional assembly，WLCSP assembly, Copper pillar bump assembly, CP house quality management.Responsibility: As the link of SMIC fab and OSATs, make sure OSATs can meet SMIC quality requirement. Customer satisfaction is the first target.1. OSATs KPI management(customer complain case, excursion case，yield，SPC，key process control，rework rate，etc.)2. New tool release and process change(raw material change，key parameter，SPEC change) management3. New OSATs development and evaluation4. Lead qualification and annual audit and audit ARs follow up5. Ranking all the OSATs every quarter, push improvement.6. Link fab and assembly site, make good quality performance7. Fan out all the abnormal case quarterly, make sure no repeat cases8. Annual quality target seetup9. Regular reliability monitor

Job Content：ETCH process management、ball place process and flux clean management and bumping final yield management.Detail job: 1.personal management and job assignment，2.New machine buyoff and new production introduce，3.throughput enhance and cost down project management，4.yield improvement，5.customer complain handle，6.daily work arrange and track. As key group leader，finish bumping 8inch wafer throughput increase from 8000pcs/per month to 33000 pcs /per month. After that，improve wafer final yield to 99.90%.Adept tools : JMP ,SPC ,office software.

镀铜制程生产品质管理以及相关专案的研究。个人主要专案：0.06core基板的量产导入，厚化铜制程的导入，垂直镀铜的导入。日常工作：产品工艺的优化、试产产品的生产指导、SOP的编辑、FMEA 编辑、OCAP 制定、MEA的更新与导入、新药水的评估与导入、产品FA分析、产线异常排查。熟悉的机台：ATO水平线、垂直镀铜线、3D量测仪、金相显微镜。公司产品主要有BGA、PP、coreless。