APAC-TAC技术支持NSE

PM, FAE光通讯测试测量以及光纤视觉检测设备

Responsible for Optical transport network (OTN) products: WDM and MSTP productsSemi-finished segment:• PCBA FT1 test (board ID calibration / software loading / electrical indicator function test), TSS , ESS (aging test), FT2 (wavelength sensitivity / OSNR test).• Evaluation and optimization of FT test plan at each stage, construction and maintenance of test station.• Monitoring and management products DOA/ERI/FRR...and tracking and analysis of important quality issue.• Collaborate with other team to complete optimization and improvement (lean 3P, QCC, etc.). Machine segment:• Ensure the delivery quality of PO and deliver orders on time. Meet the customer's customized needs.• Focus on ensuring the quality requirements of European Big T customers, Japanese and South Korean customers, participating in reviewing special customer needs, formulating delivery strategies, and finalizing WI.• According to the IPD process, the test domain DFx needs are put forward in the product new version,Pilot build stage. Work with R&D, NPI team, recognize the manufacturing test requirements for new technologies and new product processes in advance.• In the mass production phase, tracking the requirements such as DFx and new test plans in the test domain should be followed, test SOPs will be formulated.improve test efficiency, and reduce test costs.• As a project management to promote product lines, equipment development teams continue to optimize test plan/equipments. Learn from the industry's latest test solutions and test platforms to continuously improve the requirements for product cloud testing, test automation, and intelligentization.• Participate in the review, analysis of engineering changes (EC changes), and maintenance of various background data required for product testing (MES/CMES system).• Collaborate with the surrounding departments to complete various optimization and improvement projects (lean 3P, QCC, etc.).

Responsible for Smart OTDR products and RAN Solution projects• NPI – bring the manufacturing agenda and strategy to NPI projects as early as concept phase and defines the project manufacturing requirements. Bring hardware designs out of R&D and introduce them into remote production sites,focusing on high reliability, low manufacturing cost, and rapid time to market. • Work with CM to create Test and Assembly procedures for outsourced manufacturing. • Liaise with the field on customer quality issues (FYR and IDE). Drive root cause analysis on field returns and customer complaints. Owner of Root Cause Analysis and Corrective Action. • Provide technical leadership to CM and CM Support Engineering to improve manufacturing yields and reduce technical/systematic issues. • Participate and provide input to supplier selection and own long term supplier relationship management. • Acts as a conduit to the CM and key component vendors or subcontractors, ensure R&D uses components aligned to organization’s supply chain strategies.

Key Responsibilities: •Participate New Product Transfer or NPI, reviewing and/or translating assembly documentation,review and implement new production cells, include equipment setup and training of technicians.•Daily technical support for production,Technical analysis,troubleshoot on PCBA and electronic optics products, and train technicians.•Analyze, summarize and provide solutions for problems, drive continual improvement activities.•Drive the yield and efficiency improvement.•Take part in ISO9001 or ISO14001 activities happened in the company.•Other duties may be deemed necessary.