孔德棋

孔德棋 Email and Phone Number

Amazon SQM
孔德棋's Location
Zhongshan, Guangdong, China, China
About 孔德棋

广东商学院

孔德棋's Current Company Details

Amazon SQM
孔德棋 Work Experience Details
  • Amrep
    Sqe
    Amrep Apr 2018 - Apr 2022
    中国 广东 深圳
    Amrep. Support Google Home/Nest/Phone Camera/Wearable project, OK2X procedure introducing for new flex vendor, OK2X docs review, flex vendor/FATP issue handling.1. Google projects dashboard, CPCR, OK2Build, OK2Ship reports review.2. Support B70 pogo cold soldering issue, cancel the reflow cover right upon the pogo and the failure rate drop from 1.13% to 0%.3. Support Phone RCAM flex pre-bend buy off in LG and Sharp.4.Finalize FPC/FPCA REL test guideline.5.Online support TWS project in GTK and solve the pogo low shear force issue.6.Introduce CCD punch to meet golden tolerance +/-0.05mm requirement in Kinwong.7. Allign EMI with 2 flex vendor, chang EMI PC33000 to PC5600and get cost down.8. Daeduck RCAM RFPC delamination issue handling.
  • 纬创资通
    工程师
    纬创资通 Mar 2013 - Apr 2018
    Wistron, supervisor of DELL production team. Good at SMT, DIP and press fit process. Freshmen process technique training. Joined in QCC team and finished modifying DFM rule that the clearance between DIP parts and SMT components change from 3mm to 4mm. Succeed to introduce 12 series NPI models to MP. 1. Skilled for SMT problem solving, Stencil guideline, profile setup and IPC standard.2. Take charge for new product introduction, DFM report, PR issue collecting and solving, finishing all kinds of reports, such as 8D report, 3A report.3. Response to Dell product in Wistron, such as yield rate improvement, issue handling and tracking (PTH hole fill issue, Section, Dye & pry, etc.)4. Lead team to improve key models quality, AOI yield rate raise from 96% to 97.5%, DIP process DPPM drop from 12000 to 7500, achieve 2017 goal.5. Introduce VGA/COM connector PIH process, dual side PIH process, selective process, FPC process, hybrid process(lead solder paste with lead free component), low silver solder introduction.6. Rich experience at DIP component(DIMM, DIP Cap, PCI etc.) hole fill, short, tilt, void and pin invisible issue solving.
  • 艾默生网络能源有限公司
    制程工程师
    艾默生网络能源有限公司 Feb 2011 - Mar 2013
    广东中山
    Emerson,in charge of CDC design models, response for both NPI and mass production SMT stage process , use PFMEA, DFM guideline, Issue tracking list, NUDD tool to dig out the potential risk of NPI models. For MP models, I use Pareto chart, Fishbone chart to analysis the issue. Good at English writing, speaking and listening, can report by English and use English for daily communication. The spoken English need to improve in the future work.

孔德棋 Education Details

Frequently Asked Questions about 孔德棋

What is 孔德棋's role at the current company?

孔德棋's current role is Amazon SQM.

What schools did 孔德棋 attend?

孔德棋 attended 广东商学院.

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