高级硬件工程师
Current
Jun 2017 - Present
Who is 林振斌? Overview
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林振斌 is listed as 金风科技 - 高级硬件工程师 at 金风科技, based in Daxing District, Beijing, China. AeroLeads shows a matched LinkedIn profile for 林振斌.
林振斌 previously worked as 高级硬件工程师 at 金风科技 and 硬件工程师 at 北京和利时系统工程有限公司. 林振斌 holds 硕士, 微电子学与固体电子学 from 北京交通大学.
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金风科技
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About 林振斌
从事高铁列控设备硬件研发6年，目前从事风电变流器控制器硬件设计，对硬件设计相关一切比较熟悉
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2 roles
林振斌 work experience
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硬件工程师
Feb 2011 - Jun 2017
2 education records
林振斌 education
FAQ
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What company does 林振斌 work for?
林振斌 works for 金风科技.
What is 林振斌's role at 金风科技?
林振斌 is listed as 金风科技 - 高级硬件工程师 at 金风科技.
Where is 林振斌 based?
林振斌 is based in Daxing District, Beijing, China while working with 金风科技.
What companies has 林振斌 worked for?
林振斌 has worked for 金风科技 and 北京和利时系统工程有限公司.
How can I contact 林振斌?
You can use AeroLeads to view verified contact signals for 林振斌 at 金风科技, including work email, phone, and LinkedIn data when available.
What schools did 林振斌 attend?
林振斌 holds 硕士, 微电子学与固体电子学 from 北京交通大学.
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