Senior Development Engineer(Semiconductor Packaging Engineering)
Shenzhen
Mar. 2012—May. 2015Joined in engineering development department, developed semiconductor, such as camera, proximity sensor (used in smart phone), etc. Can use software (JMP, Minitab) to do DOE and analysis, familiar with FMEA, SPC, 8D, etc. to do trouble shooting and problem solving, familiar with TS16949 quality system.Familiar with processes, such as wafer mount, wafer saw, die attach, pick & place, molding, etc. Understand process parameter and workability, deeply collaborate with supplier for equipment and material performance optimizing to support process finalizing. Full experience of DOE, implementing engineering sample/prototype building, performance validating. Detailed job description as below, do product structure optimization according to product concept and design rule, make tooling and fixture, organize equipment and material for sample build, implement DOE to optimize product performance, analyze and solve problem, create standard BOM and process flow, follow pre-launch, till mass production. As a representative, regularly attend review meeting with oversea division colleagues to update progress, organize supplier support for process development, coordinate internal development activities, support production process engineer to transfer new product to mass production.Jan. 2010—Feb. 2012Joined in a manufacturing/production line for IC(integrated circuit, used in automotive industry, consumer electronics, etc.) product packaging and testing, as an assembly process engineer. In charge of processes, such as molding, cropping, forming, etc. keep process in good condition, maintain equipment running well, make process work instruction, train technician and operator, detect and solve problem, to ensure good product quality.