信号完整性工程师主管
Current Do research and discuss with team to analyze the trend of new product and industry. Work with Mechanical engineer to design PCB to fit for 3D structure. Do SI simulation and adjust 3D to meet the spec, like 24G, 56G and 112G etc. Do correlation report and find the gap between simulation and actual samples. Arrange samples building and do failure analysis and provide solution until mass production OK. Promote new production and help to solve customer’s issue by business trip. Work with customer (like Intel, HP, Dell/EMC) for industrial standard formulated. 担任信号完整性工程师,负责高速cable端连接器开发。从产品概念设计到PCB设计到3D模型的SI仿真到样品验证再到不良分析以及改善,全程参与。精通PADS, CST软件应用。有着丰富的开发经验:HDminiSAS (SFF8643), SlimSAS(SFF8654), MCIO (SFF-TA-1016), GENZ(SFF-TA-1002), TYPE-C等。