刘文彬 Email & Phone Number

2018.09 – PresentCompany: NEXCHIPPosition: Dupty Department Manager in TD_TF. Responsibility:33 CMP and TF process engineers coordinator for new process development.Achievement:• CIS, MCU,PMIC, 80nm,L55/L40nm platform development. 2004.01 – 2018.09Company: UMCPosition: Technical Manager Responsibility: 28 nm and above process sustaining and optimization 10 process engineers coordinator for mass production maintaining, excursion fixing and cost reduction projects.Achievement: 28 nm WCMP recipe and ILDCMP process optimization to improve random hard bin fail and CP yield. 40 nm ILDCMP recipe and ILD loop process optimization to improve wafer edge CP yield. Evaluate ILDCMP white light end point system and transfer to mass production to gain CP yield and cost reduction. 65 nm WCMP recipe optimization for low yield excursion 65 nm STICMP PAD evaluation for scratch defect reduction and transfer to mass production. 65 nm STICMP slurry evaluation for AA step height improvement and transfer to mass production. POLYCMP for URAM product application on line and process simplifying for cost reduction. 90 nm STICMP slurry evaluation and mass production. 90 nm CUCMP barrier slurry evaluaion and mass production.1999.8 – 2003.8Company: TSMCPosition: Thin Film Senior Process Engineer Responsibility: Responsible for Co dep process sustaining. Responsible for CVD-TIN process sustaining. Responsible for CMP tool maintaining. Pre-clean recipe of Co dep process optimization for yield improvement. NVL ECP tool evaluation and release to high volume production. CMP tool side water spray system set up to prevent slurry crystal forming for scratch reduction and yield improvement.1997.9 – 1999.8Company: USCResponsibility: Responsible for CMP tool maintaining.

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