马晓民 Email and Phone Number

- In charge of Qualcomm Smartphone chipset Snapdragon700/600/400/200, responsible for chipset GTM plan and all China customers design-in including OPPO/vivo/XiaoMi/Huawei and other 30+ customers, succeed design win 8916/8952/8953&53Pro/8976&76Pro/SDM450/SDM660/SDM670/SDM710/SM6150/SM7150 and 7250/6350/4350 etc. chipsets in all China customers with hundreds millions of shipment record already.- Work with China/India QIPL/US San Diego chipset PdM/technology PdM/PgM/Engineering for chipset feature planning and specification definition.- Close work with SW PdM for Google Android SW release plan alignment to fulfill China customer need- Support ISV(3rd party SW vendors) ecosystem and IHV ecosystem including camera/memory/display/sensor etc..- Support Competitive Analysis of Qualcomm chipset with other competitors like MTK/Samsung/Hisilicon/Spreadtrum etc.- Keep good relationship with all China leading customers and well alignment between their product roadmap and QC chipset roadmap.- Close work with marketing PR/relation team for customer product marketing promotion- Support CE for customer project execution/feature fulfillment and support sales for customer project design win

Manage Shanghai customer support team to provide local project management and technical support for all STE feature&smartphone and components chipset businesses in China with global teams support, work with marketing/sales as main PoC for new customer project/platform engagement through kickoff,development,validation,MP until after sales.

Manage Shanghai customer support team to provide local project management and technical support for all NXP platform and components businesses including 2G/EDGE(feature Phone, Smartphone,data card) from kick off, development,validation,MP until after sales, focus on HW(RF/BB/Audio/ Production) and SW(OS/driver/FS/audio/ multimedia/protocol/HWL etc.)

- As Customer Support Manager(from 2005), manage SHA customer support team to support different customer solving technical issue of Philips Sysol platform, focus on SW(OS/driver/protocol etc.) and HW(RF/BB/production), cooperate with other teams including BU CSL2(in France Lemans, Romania)/BU CSL3(India)/BU DSP team(Sophia) and BJ/SZ/TPE teams.- As HW leader with involving HW engineer in SS5130/5110LC ULC platform development and in charge of HW support to Philips Sysol GSM/GPRS/EDGE mobile platform from SHA/NJ/HZ customers.

Responsible for development of IEEE 802.11a/b WLAN Transceiver(Internal Product Number: FA5759) including LNA, mixer/upconverter in TSMC 0.18um 1P6M CMOS process for Winbond mPCI 802.11 WirelessLAN adapter (Part number: W89C33), and develop Power Amplifier in TSMC 0.18um 1P6M CMOS Process for ISM2.4GHz applications.

Involve in development of Variable-Gain LNA, High linear mixer for 900MHz GSM handset application in IBM BiCMOS process and LNA for Multi-Standard 900/1900/2400MHz wireless application in Motorola Advanced RF BiCMOS process with SiGe:C option.