1. Lead the Application of New Products.1.1 review its own structure during the new product development phase to identify design defects that are not conducive to SMT application and to propose improvements.1.2 review their corresponding PCB PAD during the new product development phase to ensure that problems with SMT applications are avoided.1.3 Recommend reasonable SMT Stencil design and reasonable SMT process flow in the product development stage with its PCB PAD and characteristics.2. the product enters the guest SMT end to have the related paste and the weldability question, through the review to the occurrence question to clarify is the product question or the SMT process question, and puts forward the corresponding improvement countermeasure.2.1 Successful case: SIM card occurs SMT the guest open solder issue, It is found that a mounting machine SMT by the guest produces greater pressure on the SIM card, resulting in stress storage before the reflow. In the process of reflow, the card is deformed due to stress. Finally ,200 K of products can be used smoothly in the SMT.3. visit MES suppliers SMT production lines of customers (Inventec / Huawei / Xiaomi / OPPO.) to determine their production lines to meet product characteristics and provide feasible improvement measures.

1. responsible for the coordination of SMT PE work, reasonable organization to maximize the effectiveness of the work of the members of the organizationChemical transformation.2. analysis of product layout and PCB layout optimization with basic line bodySave PCB cost and provide line utilization).3. is responsible for coordinating the preparation of all conditions of the production line before the guest audit and the accompanying explanation when audit.4. program balance to improve equipment productivity and output.5. push the engineer to complete the preparation of the NPI's pre-work tools Gerber review, during the processissue in-depth analysis, proposed improvement measures, DFX issue proposed, and interaction with RD,PM,Promote improvement.6. lead the engineer to complete the analysis and improvement of customer complaint issue and 8 D reply.7. the existing process of SMT and DIP line is refined and completed through process optimizationThe reduction of production costs.

Working experience SMT 9 years. Lead engineer, process engineer, process team leader, engineer.1. as the SMT process manager, develop the annual KPI, of the department to lead the team to achieve KPI, performance appraisal and training of subordinates.2. rotation is responsible for night shift SMT production management and 7 S.3. Review SMT FPY and UPPH,Unit cost and manpower.4. responsible for the establishment and introduction of plant-based projects, such as SMT automation equipment (Auto convey,auto pressure...) and participation in the establishment and optimization of the feeding management system.5. familiar with Acer/Asus/Toshiba/Samsung and other customer management quality indicators, responsible for customer and ISO annual audit for 3 years, and corresponding improvement.6. familiar with Notebook manufacturing process, 5 years ODM/OEM NPI experience, familiar with NB-DFB rule and equipment performance, work with DFX/RD to achieve the best capacity, cost and quality after MP.7. regular co-work Intel and LAB to develop steel plate rule and process capability, familiar with lead-free process furnace temperature requirements, rich experience in over-furnace vehicle development.8. skilled use of 6 sigma to solve various SMT welding problems experience, and participate in multiple 6 sigma improvement projects.