嵌陶瓷汽车线路板开发制作和设计，生技协同制前工艺路线分析样品难点和制作过程中分析解决样品数据分析和报告总结

负责RFID产品技术能力整合和提升，技术和品质部门和生产部门协同的调整和优化，客户和供应商的对接。Charge RFID product technology ,made the technology improved and process ability better; adjusted the technology members structure and setup the QA,manufacture ,PE department QCC team;touched the customer side concern and the issue with vendor.

研发部高级研究员和项目leader1）2016年主要负责CVD后铜箔的预处理，刻蚀和风干，结合以前的经验对刻蚀药水进行了优化，架构了药水的化验分析，对工艺和设备进行了优化改进，取得了较好的效果，石墨烯薄膜的阻值有明显的降低2）2017年带领团队负责石墨烯薄膜的外观良率项目，通过对各工序的SIPOC详细测试排查，科学的检测分析，参数的对比优化，石墨烯薄膜的外观良率取得明显的提升。3）2018年带领团队负责单层石墨烯的研发项目，通过较复杂的分析，测试对比，使单层石墨烯成功在SENSOR和加热膜上获得了应用，大大节约了材料的成本。4) 2019年继续将公司的系列产品单层生产继续推进。2016.1—Present  WuXi Graphene film Co.,LtdDepartment：R&DSenior Research/Project Leader1)2016, Mainly charge the copper after CVD pre-etching ,etching and dopping, improved the etching chemical liquid, worked out the analysis method and system, improved the process parameter and the equipment, the value of resistance obvious reduced, uniformity and reliability got obvious promotion. the graphene film product could mass production from the test mode. And studied others chemical etching system , tested brush and sand-blasting process to improve the present pre-etching method. got the honor of the best excellent employee.2）2017,lead the cross team from different department and  R&D team with three members to solve the graphene film appearance issue, we studied  the SIPOC of every workshops, we studied the element of the impurity via the science instrument(SEM,EDS),all workshop environment including cleaning room, material, instrument and parameter, did many tests,as the result, the appearance yield of graphene film promoted to the target line (70%), and our team got award.3）2018,lead the R&D team to study one layer graphene item ,we did many test, studied the etching chemical solution in system; compared the product structure in whole panel, different method of protective film press. different transfer machine’s compared ...etc,we got the touch panel yield with single layer graphene increased to 68%,and the heater film with single layer got good yield too, the cost of heater product down 50%.4) got one patent for invention, and one patent for utility model, three patents are in approving.

Description:负责腐蚀（DES）线和RTR腐蚀线，油墨产品显影线，微蚀表面处理工序的作业指导和参数控制计划及FMEA的建立和改进；工序不良的分析改进和持续改进；工艺改进团队，工艺技术员和检验员的管理和推动；员工的培训考核;定期向管理层汇报产品良率提升情况。取得成绩如下1.湿处理工序运转良好并持续改善,维持了较高良率；2.带领改善团队在 2006-2007年度把主要产品的良率提升了4%,为公司创造利润约500万;2007-2008年度提高了约2%,创造利润200多万3.2007年度获得上海伯乐昆山分厂"TOP ONE"员工荣誉，绩效为昆山分厂首位 2011年始任湿区主任工程师，带领工艺技术人员负责如下1.蚀刻不良的分析解决，整顿整合设备，参与新设备购买规划，新蚀刻线的技术招标，测试，试产和验收。2.负责黄光无尘室工艺，曝光不良的分析解决，智能卡产品良率提升。3.压合工序工艺维持，物料节约改进，配合镀铜，磨刷，表面处理，金回收，电测问题解决和维持。从2006年，公司引入精益生产的TPS系统和理念，即JIT和PM等的全面进行GK改善，多次作为项目leader带领团队进行品质，效率，设备方面的改善，取得了非常好的效果，也积累了丰富的精益生产的经验。1)Charge the Etching(DES) process WI, control plan, FMEA, actual operation, continue improve the process situation and product yield. 2) Work out the new Schmid etching line detail requirement and workshop layout with buy off team , took part the equipment setup and adjust till mass production. 3) Study the new etching line "should be" condition with team and work out maintenance WI . 4) main product yield improvement and detail defect study and trouble-shooting.  5) charge the imagine process ,control plan, FMEA, actual operation, continue improve the process situation and product yield., help the OLEC exposure machine engineer do the maintenance. improve the RTR product imaging yield. 6) Charge Lamination , copper plating, shadow, Ni-Au plating, OSP process etc.

Description:1)Charge the Etching(DES) process WI, control plan, FMEA, actual operation, continue improve the process situation and product yield. 2) Work out the AEEnew etching lines detail requirement and workshop layout, took part the equipment setup and adjust till mass production. 3) Study the new etching line "should be" condition with team and work out maintenance in plan . 4) main product yield improvement and detail defect study and trouble-shooting.5) Charge cleaning line and oil developping line.

Fccl material process control ,coating machine setup,material criteria analysis,the DES line chemical liquid analysis method setup.

Take care the computer mainboard SMT and DIP quality issue.