闫海东's Location
Jinnan District, Tianjin, China, China
About 闫海东
闫海东 is a SiC功率模块封装技术专家 at 浙江大学杭州国际科创中心.
闫海东 Work Experience Details
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Sic功率模块封装技术专家浙江大学杭州国际科创中心Tianjin, China -
Sic功率模块封装技术专家浙江大学杭州国际科创中心 Apr 2021 - Present中国杭州 -
博士桂林电子科技大学 Dec 2017 - Present中国 广西 桂林研究领域：（1）压力辅助银烧结工艺及其界面可靠性评价 （2）多尺度银颗粒焊膏制备与无压烧结机理（3）高密度低感功率模块工艺集成技术（4）高温功率器件热管理技术 -
科研人员江苏宏微科技股份有限公司 Oct 2015 - Jan 2017江苏常州国家高技术研究发展计划（863计划），第三代半导体高密度封装工艺技术与关键材料（科研合作）。针对当前高温SiC和GaN器件互连方面存在的技术瓶颈，系统地开展了面向高温应用和低温烧结的新型无铅高热导互连材料、工艺及高密度功率电子集成技术研究。 -
电子封装工艺设计师中国电子科技集团第五十一研究所 Jul 2011 - Aug 2013中国上海负责**电子干扰设备的微组装工艺和电子装联工艺。
Frequently Asked Questions about 闫海东
What company does 闫海东 work for?
闫海东 works for 浙江大学杭州国际科创中心
What is 闫海东's role at the current company?
闫海东's current role is SiC功率模块封装技术专家.
What schools did 闫海东 attend?
闫海东 attended 天津大学, 天津大学.
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