a) Facilitate joint venture negotiation for OEM and MRO businesses;b) Management of international suppliers, and set up international sourcing mechanism;c) Set up routine operation mechanism of department, recruit personnel;d) Set up connections with international research institute and industrial associations;e) Collect and analyze market information, for product line development planning;

a)Build team of drilling controls and recruited personnel, supervise 36 engineers; b)Make & implement offshore drilling controls engineering strategic plan for O&G China; c)Set up full functions of offshore BOP controls, including NPI, requisition and service; d)Set up comprehensive team capabilities, including SW, EE, hydraulics, ME, evaluation & test, project management… e)Set up R&D facilities and operation process: e.1Lab Phase I(2M$), for legacy subsea MUX-BOP controls; e.2Lab Phase II(1M$), for Jack-up BOP controls, next-gen subsea BOP surface control; e.3System requirement management based on Doors platform, following GE O&G NPI process guideline, DPP process guideline, API/DNV/ABS/CCS industrial standards; e.4Design process based on GE O&G NPI and DPP guidelines; e.5Evaluation process based on GE O&G NPI and DPP guidelines; e.6Fast work methodology experiment in team; f)Make and implement marketing strategies of GE offshore BOP products in cooperation with sales and marketing for Asia-Pacific market; g)Initiate Jack-up BOP NPI, lead engineering team and be in charge of product line requirement analysis, design solution proposal, engineering task plan and execution, as host for milestone reviews like CDR/PDR/DDR/DVR… h)Execute manufacturing localization strategy for Jack-up BOP control product i)Play critical role for subsea ultrasonic array blow-out prediction system(EKD) NTI prototype build-up (electronics, software and mechanical), in cooperation with GE GRC-SH; in charge of supplier qualification and manufacturing capability build-up; j)Maintain products and support global customers for GE offshore BOP controls; k)Manage and evaluate personnel, plan salary & bonus, make professional development plan; l)Administer and execute CIC drilling controls team annual budget plan; m)Lead cross functional operations and multi-site cooperation; n)One year on-site work experience at Houston, US; o)2-year Excellent grading on current role;

a)Helped setting up GE CIC IP embedded system & avionics team; b)Led R&D team implementing ARINC 429 NPI project, as project manager; c)Worked as co-architect of ARINC 429 project firmware & software, with US engineer; d)Led user software development of ARINC 429 NPI project, based on NI/LabVIEW platform; e)Led the team making local work flow and standards, like adoption of agile process; f)Led CIC avionics lab set up, for ARINC429 prototype evaluation ; g)Product developed applied in ARJ21 commercial jet prototype ground evaluation; h)Research of compact architecture for AFDX bus card NPI, based on new GE IP platform; i)One month in GE IP avionics office, Santa Barbara, CA, for ARINC standards training;

a)Developed, integrated and tested new product software for: a.1-EBT90K system(3M$ LCD panel metrology equipment, Solaris Unix and VxWorks) a.2-Inkjet40K/55K system(8M$ LCD panel pixel precision implanting, Solaris and VxWorks) b)Developed simulation platform for EBT and Inkjet systems, for vacuum robot and I/O; c)Managed PECVD software upgrade for solar industry customer(First solar, Germany); d)Gained around half year on-site work experience in headquarter, Santa Clara, CA; e)Won top contributor award;

a)Developed da Vinci PVD system software(2.5M$ chip manufacturing equipment); b)Developed and maintained lab evaluation software for da Vinci PVD prototype; c)Improved tool productivity by optimizing system settings, hourly rate increased around 40%; d)Prototype assembly, installation, integration and evaluation.Integrated and tested vacuum robots; e)Compiled system manuals and trained customer operation engineers; f)Led ultra-thin wafer feasibility project for Intel; g)Supported customer demo of da Vinci prototype for Samsung and TSMC; h)Gained around half a year on-site work experience in headquarter, Santa Clara, CA; i)Supported first customer shipment manufacturing & test, Austin, TX; j)Won top contributor award