10+years IC fab process experience, good at wet clean/etch/strip process and wet plating process, familiar with CMP process, 2 years 12Inch silicon&epi wafer maker experience.
上海天岳半导体材料有限公司
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工艺部经理上海天岳半导体材料有限公司 Jun 2022 - Present上海临港Responsible for SiC wafering line process (Wire sawing / Grinding / Polishing /CMP & Cleaning…)
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部门经理武汉敏声新技术有限公司 May 2021 - Jun 2022中国WET&CMP department（PE&EE）management & preparation -
工艺经理Zing Semiconductor Corporation May 2019 - May 2021中国 上海Focus on 12 Inch Silicon Wafer etching/cleaning/polishing（CMP） process -
工艺主管Silan Micro-Semiconductor Oct 2015 - Apr 2019中国 浙江 杭州Participate in 8 Inch FAB & WET&CMP process team building. Specialize in wet clean and wet etch&strip process -
工艺工程师中芯国际集成电路制造(上海)有限公司 Jul 2009 - Sep 2015中国 上海市区WET clean/etch/strip process & ECP single plating process for BEOL（TSV&Bumping）
安鹏飞 Education Details
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Industrial Engineering
Frequently Asked Questions about 安鹏飞
What company does 安鹏飞 work for?
安鹏飞 works for 上海天岳半导体材料有限公司
What is 安鹏飞's role at the current company?
安鹏飞's current role is 部门经理.
What schools did 安鹏飞 attend?
安鹏飞 attended 合肥工业大学.
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