Product Promotion: Take charge of Infiniband network product portfolio and Ethernet network portfolio market development in China, including network adopter and switch.Analysis marketing requirement about Data center，Telecom carrier and Enterprise such as Broadcast & TV field and Securities

Market expansion: Based on the company's self-developed AI acceleration card with TPU, I have developed the new industrial computer partners, and have realized the first computer vision artificial intelligence product with TPU in the field, supporting the sales of security products in domestic cities;Strategic planning: Accurately analyzed the industry development direction and competition pattern, combined the company's strategic planning and business advantages, and lead the company to break through the traditional single product type and application market (AIOT product direction, driverless product direction) through the mining of customers’ requirement;Product management: AI chip demand collection on Cloud, architecture selection, chip development process management, and life cycle management of AI Chip;Technical direction: Focusing on the design of a high-performance server with optical interconnection architecture between chip, optical computing technology planning, and optical switching technology, etc. Cooperate and exchange experience with leading research institutions and companies of silicon photonics in the U.S., Japan, Singapore, and Belgium, such as Intel, IMEC, global foundries, Rockley, Ayar Labs, AIM, AIOcore, AMF, etc. And output silicon photonics technology application analysis plan for blockchain and AI server product;Resource docking: Through long-term strategic cooperation with Semiconductor Institute, Computing Institute, Automation Institute, Zhejiang University, Shanghai Jiaotong University, and other universities;Analysis of competing products: Collect and analyze performance parameters and application scenarios of various AI chips in the industry, and compare advantages and disadvantages;

Product planning: Lead in implementing the company's medium and long-term development plan and annual work plan about Router/Switch/Optical Module and related chips, such as NP/TM/SC/MAC and ODSP;Technical Analysis：Engage in Copackaging project, which combines several 1Tbps Silicon Photonics dies and 4T switch dies into one package, and this project is a Demo for DT.Product management: Engaged in the life cycle management of product group, formulated the product evolution route and delisting plan, combed the intergenerational relationship of dozens of network product line chips, including 350nm, 180nm, 130nm, 90nm, 65nm, 45nm, 32nm, 28nm, 16nm, and other chips;Leading technology: Developed 56G network platform forwarding and switching chip, Analyzed the requirement of 5G, Data Center, access network, transmission network, router scenario, Analyzed product about BRCM, Cisco, Juniper. Successfully completed two 7nm chips charter work, the project amount with $90 million; Developed 100G/400G/800G high-speed optical module and DSP chip roadmap and project charter work, achieve two 400Gbps ODSP chips charter of 7nm process, with a project amount of US $25 million, established the company's leading technology capability of optical interconnection in the data center;Scene analysis: Deeply researched on the scene analysis of 25G, 50G, 100G, 200G, 400G optical module ( VCSEL, silicon light, InP solutions) of Data Center network architecture about AWS Microsoft Google Facebook Alibaba Tencent ;

Test plan design: develop end-to-end EDA, ESL, FPGA, EMU, ASIC, production test plan design, test case preparation, and automatic execution, and independently establish test solutions integrating test design, test execution, test analysis, and test management;Establishment of test platform: developed automatic test solutions for chips and SDKs, developed practical test architecture, and built an automatic test platform;