Kyungmin Bae Email & Phone Number

< Chemical Engineer > Chemical test for ECD Cu, Ni and metal alloy plating and E’less Ni, Cu process Copper plating ECD Cu Spherolyte UF3 window test for via filling on RDL design_SK HynixECD Cu Spherolyte UF3 chemical optimization for Power device back side metalization_LB lusemVia fill copper plating development for Micro LED interporser_NepesCopper pattern plating(200um) development on Cu alloy panel_SEMCOMatt copper plating for lead frame_TSPHigh speed Copper plating_Automotive part suppliers and electronics device suppliers.Copper plating bath management and trouble shooting Nickel platingEvaluation copper diffusion according to ECD Ni thickness_Samsung electronicsDecrease of magnetism in Ni-P plating layer for Camera module_ShinsungRough Ni plating for improvement adhesion on PP film_SoulbrainNi-P, Ni-W alloy plating process evaluation_Yujin Tin platinglow rough matt tin plating evaluation for OEM(Murata) qualification_TSPHigh speed Tin plating additive optimization_TycoTin plating bath management trouble shooting_TSE E’less processIGBT and MOSFET FSM(Front Side Metallization) ENIG, ENEPIG on Al alloy pad_LB lusemSiC wafer FSM ENIG, ENEPIG on Al alloy pad_LB lusemImmersion Tin for improvement reliability PMIC device_LB SemiconAdhesion promotor for E’less Ni & E’less Cu plating on PI_Toray Etc.New chemicals deflash project_Samsung electronics, JAS techLow etch Cu roughness chemical project_TSP, Samsung ElectronicsSilver adhesion promotor chemical project for Lead frame package_HSDS, Samsung ElectronicsGold adhesion promotor chemical project for PPF lead frame package_HSDSPost treatment chemical project(AntiEBO, organic coating)_HSDS, TSP, Smasung ElectronicsChemicals analysis (TIT, AAS, UV)< Marketing & Sales > Functional Electronics coating product manager and Wafer plating process Engineer Find a new business with customers. Demo plating line set up and conduct test for OEM qualification. Mainly focus on ECD Cu, Ni, Tin, E’less process for package applications and lead frame package Etc. Contact to OEM company to introduce Atotech new chemical. Basically, contact with equipment company for new chemical process (Discuss about chemical process and equipment specification)