김경태 Email and Phone Number

Application engineering manager & Customer Site manager to provide Memory repair algorithm for DRAM & Nand flash of Samsung & Hynix, and control / handle EDS(Electrical Die Sorting) process productivity & quality issue.• Core member to provide memory repair solution for continuing DRAM & Nand Flash shrink road map & improving memory device performance.• Core member as Customer Site manager to provide Electrical Die Sorting process’s productivity &quality solution for DRAM & Nand Flash from Samsung & Hynix, & locate root cause of package test failures.• Failure Analysis on various semiconductor package type - Samsung 32G MCM(Multi-Chip-Module), ASE Korea Discrete /HSOP /QFN /SSOP /FlipChip, Amkor POP package.• Laser solution application for Samsung Solar cell grooving, wafer dicing, LCD repair, OLED de-layering, and KEC Platinum temperature sensor development. • Co-develop with customer for continuing technology roadmap to provide optimum memory link processing solution./ up to 4X nano nodes, Copper fuse, LowK ILD solution. - Jul ’09 / up to 3X nano nodes, Copper fuse, Multi-pulse laser solution. - Apr’11 • Technical consulting on laser solution for security feature, security thread to KOMSCO(Korea Minting & Security Printing Cooperation)

• Core member to provide optimum solution/product for new customer (TRW, Siemens, Delphi in European & Kefico, INZI in Asia- Pacific customer) by deeply co-working with / provide technical consulting to Freescale PE or Sales engineer.• Quality-oriented mind based on 9+ year experienced with Freescale Automotive product as a seasoned MEMS test engineer specially following for;• Turnkey solution provider of Test System & Software from thorough on-chip circuitry basis and device functioning as customers(Motorola / Freescale / On-semi / Siemens / Delphi / TRW, etc.) continue to be mandated.• Process & Product engineer with extensive experiences in a development and new product introduction environment, providing collaborate problem solution to customers by verifying assembly & wafer factors affecting test output, based on depth of Failure Analysis.• Coordinate Product / Assembly / Test eng’ring resources to resolve various customer quality issuesby leveraging front-end & back-end process knowledge.• Contribute yield improvement by Test program / Test system improvement, assembly process stabilization through DOE, wafer standpoint FA, based on statistical approach & analysis.• Contribute test time reduction by Test program development & OEE improvement for single or multi-site test handler.• Test Project Leader on RTPM(Remote Tire Pressure Monitoring) & Package Evolution per ASIC for GE Infrastructure Sensing & Project Leader to deploy the new MEMS die manufacturing line by managing/ coordinating the project details under the well arranged milestone, and improve quality & yield level of each semiconductor Assembly & Test process with the statistical approach with the least cost impact.• Semiconductor Electrical Test process manager with highly motivated work ethic, eng’ring mind & logic as company’s official Master FMEA(Failure Mode Effect Analysis) instructor, providing lecture to the process engineers.

• Responsible for Automotive/Industrial sensor assy & trim&test process engineering.• Responsible for Process Stabilization/Characterization between Electrical Test and Assembly Process(Including Wafer Fab) thru DOE, Two-Level/Full Factorial Experiment, T-Test, ANOVA, Regression Analysis(Correlation Test), RSM(Response Surface Methodology),accomplished more than 17% of test yield progress since 1997.• Contribute process stabilization of automotive pressure sensor device portfolio, especially Siemens yield up to 93.6% from 54.5% by wafer(Glass frit thickness) & assy (rtv & gel interaction) attribute root cause identification.• Medical Trim algorithm development per die shrink conversion project to BMC.• Test algorithm development for Becton Dickenson , blood pressure monitoring application.• Soft landing of New package, SOP by successful completion of qualification plan.• Characterization on BMC MEMS fab die material & successful qualification.• Automotive Tri-temp tester with Delta Handler OEE improvement to 86% from 49% based on mechanical, software, process standpoint improvement.• Simplifying laser trim process by annealing process elimination on Automotive integrated pressure sensor by resistivity shift evaluation.• Locate root cause of chronic offset shift on Arrow by provide solution for Gel & RTV combination recipe.• Design die coating material process control for DOW Q7-2218 by time on bias characterization DOE.• Participate in CQI (Customer Quality Issue). Conduct first line trouble shooting and diagnostics in the field and on returns on a test bench as required, to expedite resolution process of quality issues.• Participate and supports customer audits of ASE Korea facilities and systems. Also participate Customer Site Audit (TRW England, Haier Taiwan, and INZI Korea, etc.) as a Global Problem Solving team per customer request. Participate in self-audits to identify opportunities for quality improvement.

Responsible for Audio RF circuit design in Product Planning Department to develop future-oriented product with long term production target based on marketing, consumer preference, and cost effective aspect.