박성욱 Email & Phone Number

São Paulo Area, Brazil

- Quality Engineering and FA Lab Sr. Manager + Set-up mobile memory process and quality monitoring, and identified defect mechanism and solution + Risk assessment with package construction analysis and understand each process combine function + All process quality management from Die preparation to test + New production qualification and risk analysis + New material and process condition evaluation to improve process quality + Set-up flipchip process and failure analysis + Improve SDBG quality(Stealth Dicing before Grinding) + Renewal FA and Reliability procedure for resource efficiency

대한민국 경기도 파주

- Supplier chain management for internal/external customer issue + Automotive customer quality issue handling with raw material problem + Chronic issue solving for Leadfram like as LF discoloration and plating function + Reduced 80% of Flipchip OSP void (Organic Solderability Preservative)- Failure Analysis and Reliability engineer + Identified new failure mechanism of Al hydroxide for Cu wire application, and process monitoring method + Identified Solder ball-off mechanism by IMC broken(InterMetallic Compound) by abnormal board mounting condition + Improvement failure analysis through TDR analysis(Time Domain Reflectometry) to indicated failure point without device destructive + Set-up new equipment for failure analysis

대한민국 충청남도 천안

- Failure Analysis, Process quality Engineer + Set-up reliability test plan base on Jedec and AEC Q100 + Set-up new equipment of FT-IT for process material control + Set-up BOC process + TFT activation for MES system of quality part