[Responsibilities]- Field Service (Hardware, Electrical, Process) Engineer- General management of field work through Customer Service- Team Sub Leader and General Manager of JEP[Major Performance]* Samsung JEP equipment total progress and customer Qual completed* Samsung Foundry CLN process EP, DSP, Hot Phos, HSN, EKC 580, HSAT, BTS (BEOL Titanium Strip) process JEP progress* Samsung JEP equipment setting (Hardware, Process) concept and Tool analysis data check* Equipment installation, hardware, and process parameters can all be set* Recently completed Samsung Foundry CLN process HSAT process JEP Qual

[Responsibilities] - Main Product: PCB, Semiconductor Process Chemical Production (Copper plating agents, Etching agents, PCB Process chemical)* Responsible for developing Ni-Cr, Ag and ITO etchings for TSP* Stabilization and management of PCB production line new plating products.* Completed the development of DFR stripper for LG Innotek Tenting, Korea. * The government's national project plan, agreement, and development alone.* A final report on the government's national projects and the project closure alone.[Major Performance]* Completed the development of etching materials for LG Innotek TSP and passed the customer's assessment* Starting with the national project plan for PCB process chemical development through co-work Proceed to complete the task* Under consultation with chemical processes developed exclusively through national project for supplying 2 billion chemical* Passing in-line test and further consultation with the independently developed process chemical AT&S in China.

[Responsibilities] * Responsible for the development of cleaning agents that clean the surface of the RTs before PI is applied during the display production process * Participation in development of PI rework material used in FPD [Major Performance] * Development of China's BOE PI Pre-Clear, pass customer evaluation and wait for line evaluation. * Completed development of BOE's PI rework technology and passed customer evaluation.