Material Synthesis of natural polymer, Developing 3D-printing (DIW)

[Dielectric etch process development for 3D-NAND memory device]- Especially in channel hole etch supporting SK Hynix- Developing HARC (High Aspect Ratio Contact) etching under various condition - DOE test based on the customer’s target and providing state of the art trend[Productivity work and improvement yield of cryogenic etch (LAM FLEX series)]- Reducing total process and cleaning time in order to improving productivity- Enhancing performance of extreme edge area on wafer with the latest HW technology- Trouble-shooting based on hardware and process approach for stability of process control[Building strong relationship between customer and headquarters in USA]- Managing customer’s needs and delivering core techniques