김형석 Email and Phone Number
R&D Package Engineer, Amkor Technology Korea - 5G Antenna Module Package Development - Double Side Molding BGA Advanced Package Development - Advanced RF Module Package development현재 Amkor Technology Korea에서 Package 제품 개발 Engineer로서 근무해오고 있습니다.System in Package, Advanced Package 제품 개발 Project에 참여하며 담당 제품의 Packaging 공정 별 발생한 Defect 원인 분석, Defect 개선을 위한 Process 개선 및 검증 업무를 수행해오고 있습니다.
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Research And Development EngineerAmkor Technology Korea Oct 2020 - Present인천시 연수구1. 5G Antenna Module Package Development - Mold Process development for High-k Thermal EMC - Advanced Package design : Double-side BGA, SBA, Saw, UF Process development2. Double Side Molding BGA Advanced Package Development - Package Warpage improvement : EMC 3 candidates DOE & Qualification - SMT, Mold Process3. Advanced RF Module Package development - Die Crack Improvement : Wafer DP Process development & optimization - Die Fly issue improvement : SMT Process Optimization - Wafer DP, SMT, D/A process
Frequently Asked Questions about 김형석
What company does 김형석 work for?
김형석 works for Amkor Technology Korea
What is 김형석's role at the current company?
김형석's current role is Amkor Technology Korea Package Development Engineer.
What schools did 김형석 attend?
김형석 attended 국민대학교.
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