3DiS Technologies is a service provider of semiconductor packaging design and assembly using an innovating 3D interconnect technology. This technology enables high performance 3D inductive passive device implementation beside or above IC, as well. Based on a reduced number of technological steps and perfectly adaptable to the constraints of the client's application, the proposed process is ideal for System-in-Package, Wafer-Level-Packaging and above-IC inductive device integration. Our cost effective solution reduces time-to-market and leads to miniaturized and more efficient electronic systems.
Company Details
- Employees
- 4
- Founded
- -
- Address
- 478 Rue De La Découverte, Cs 67624 - Mini Parc 3,france
- Industry
- Semiconductor Manufacturing
- NAICS
-
Semiconductor and Other Electronic Component Manufacturing
- Website
- 3dis-tech.com
- HQ
- Labege
3dis Technologies Questions
3Dis Technologies's website is 3dis-tech.com
3Dis Technologies's LinkedIn profile is https://fr.linkedin.com/company/3dis-technologies
3Dis Technologies has
4 employees.
View email and phone details for 4
employees at 3Dis Technologies.
3Dis Technologies's industry is
Semiconductor Manufacturing
3Dis Technologies's top competitors are
1st-Relief Gmbh,
Dinapsia,
Kla,
Datamentis,
Clink.com,
Ses Satellites,
10x-Tech,
Astel - Semisyn,
Crea - Advantest Group,
Dg Light S.r.l..
3Dis Technologies's categories are Semiconductor Manufacturing
3Dis Technologies's founding year is 2014
