APPLAUSE ECSEL Project

The strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufacturing and packaging value chain to Europe – or even start to bring it back. APPLAUSE supports this by building on the European expertise in advanced packaging and assembly to develop new tools, methods and processes for high volume mass manufacturing of electrical and optical components. The technologies will be piloted in 5 industrial Use Cases, related to: 1. Ambient light sensor for mobile and wearable applications (ams) 2. Thermal IR image sensor for automotive and surveillance applications (IDEAS) 3. High speed datacom transceivers (DustPhotonics) 4. Flexible patch for cardiac monitoring (Precordior) 5. Miniaturized invasive cardiac sensors (Cardiaccs) The APPLAUSE consortium is built of a number of leading experts from European electronics packaging companies representing different value chain levels related to advanced packaging and smart system integration. The parties have complementary expertise in conception, design, packaging, testing and manufacturing of electronic components, as well as a wide range of expertise from several different end use areas. The unique European ecosystem established within the consortium represents the competitive, leading edge of the technologies available. This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 826588. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Belgium, Germany, Netherlands, Finland, Austria, France, Hungary, Latvia, Norway, Switzerland, Israel.