Argotech – Semiconductor Photonics company information, Employees & Contact Information

Company Details

Employees

14

Address

Náchodská 529, Trutnov,královéhradecký Kraj 541 01,czech Republic

Industry

Appliances, Electrical, And Electronics Manufacturing

NAICS

Electrical Equipment, Appliance, and Component Manufacturing

Other Electrical Equipment and Component Manufacturing

Battery Manufacturing

Communication and Energy Wire and Cable Manufacturing

Wiring Device Manufacturing

All Other Electrical Equipment and Component Manufacturing

Storage Battery Manufacturing

Primary Battery Manufacturing

Fiber Optic Cable Manufacturing

Other Communication and Energy Wire Manufacturing

Current-Carrying Wiring Device Manufacturing

Noncurrent-Carrying Wiring Device Manufacturing

Carbon and Graphite Product Manufacturing

All Other Miscellaneous Electrical Equipment and Component Manufacturing

Website

http://www.argotech.cz

Keywords

DIE BONDING - soldering or epoxy fixation, flip chip, face up, components size from 150*150 μm, placement accuracy ± 1µm, WIRE BONDING - ball-wedge, wedge-wedge, BSOB, Gold or Aluminium wire from dia 17+μm, WAFER PROBING (burn-in) - electrical, optical, spectrum measurement, bare die chips and optical diodes, OPTICAL COUPLING - butt & free space optics in active alignment mode, coupling lasers and PDs, laser welding & adhesive fixation, HERMETIC ENCAPSULATION - Nitrogen and other gasses, TEST & INSPECTION from wafer level to components, and SUBSTRATE DICING - (Silicon, GaAs, AL2O3, ALN, Silica etc).

HQ

Trutnov, Královéhradecký kraj

Competitors

ARGOTEC, LightHouse - PIC design & development, SENKO Advanced Components, Inc., ArgoTech, ADOPTION Project, LIGENTEC, ArgoTech srl, PhLEXSAT Project, Agropart Dienstleistungen GmbH, MicroAlign.